Other materials
3D Printing、MIM、HIP、Brazing、Spraying、Porous material、PM
1. High strength and toughness: The weld is dense, with high tensile strength and impact resistance. 2. Corrosion resistance: It has good resistance to acids, alkalis, and high-temperature oxidation environments. 3. Low melting point: Brazing temperature range 780~850℃ (adjustable), suitable for a variety of substrates. 4. Good fluidity: Strong wettability, uniform weld filling, and low porosity.
1. Low melting point: brazing temperature range 620~750℃, energy-efficient and highly effective. 2. Strong wettability: good fluidity, can fill complex welds, and ensure firm bonding. 3. Corrosion resistance: resistant to water vapor and weak acid-base environments, extending the service life of workpieces. 4. Economic efficiency: moderate silver content, high cost performance, suitable for mass production.
1. High Electrical and Thermal Conductivity: The surface silver layer provides silver-like conductivity (resistivity ≤2.5 × 10⁻⁶ Ω·m) 2. Strong Oxidation Resistance: The silver layer isolates the copper substrate from oxidation, extending the material's stability 3. Cost Advantage: Significantly reduces the amount of precious metals used, with a higher price-performance ratio than pure silver powder 4. Process Adaptability: Compatible with various processing methods such as cold pressing and sintering, spraying, and paste printing
Ternary eutectic solder, low temperature, good fluidity and process performance, will form brittle intermetallic compounds at the weld, cannot be used to connect ferrous metals, nickel-based alloys or nickel-copper alloys containing more than 10% nickel
Excellent process performance, moderate melting point, good wetting performance and gap filling performance, excellent strength, plasticity, conductivity, corrosion resistance and other properties
Gas atomization process, spherical powder, low oxygen content, particle size controllable, low density
1. Low-temperature brazing: Liquidus temperature of approximately 620℃, reducing the risk of damage to heat-sensitive components. 2. High electrical/thermal conductivity: Low solder joint resistivity, suitable for electronic components and conductive contact welding. 3. Morphological adaptability: Powder: Uniform particle size (20-75μm), good fluidity, suitable for automatic powder feeding or pre-placement processes; Paste: Contains environmentally friendly organic carriers, strong adhesion, convenient for manual coating. 4. Strong corrosion resistance: Excellent oxidation and sulfurization resistance of the solder joint, extending component life.
1. High Electrical/Thermal Conductivity: 72% silver content, low solder joint resistivity, suitable for welding precision electronic contacts and conductive components. 2. Corrosion Resistance and Oxidation Resistance: Excellent stability of solder joints in humid and high-temperature environments, extending equipment life. 3. Flexible Forms: Powder: Uniform particle size (15-50μm), good fluidity, suitable for automated powder feeding processes. Paste: Contains environmentally friendly adhesives, convenient coating, strong adhesion. 4. Excellent Wettability: Fully wets base materials such as copper and stainless steel, resulting in dense, pore-free welds.
1. Active Brazing: Titanium element removes the oxide film, achieving a high-strength metallurgical bond between ceramic and metal. 2. High Heat Resistance: The braze joint can withstand temperatures above 600℃, and has excellent thermal shock resistance. 3. Morphological Adaptability: Powder: Ultra-fine particle size (5-25μm), high purity, suitable for precision pre-placement processes. Paste: Contains low-volatility organic carriers, uniform coating, suitable for welding complex structures. 4. Strong Wettability: Excellent wettability for alumina, aluminum nitride ceramics, and refractory metals.
1. Ultra-high purity: Silver content ≥99.95%, total impurities ≤500 ppm 2. Spherical morphology: sphericity >95%, good fluidity, suitable for screen printing, spraying and other processes 3. High conductivity/thermal conductivity: volume resistivity ≤1.6 μΩ·cm, thermal conductivity ≥420 W/(m·K) 4. Controllable particle size: standard particle size 0.1-20μm (customizable), low specific surface area, high sintering activity 5. Oxidation resistance: surface coated with anti-oxidation layer (optional), extending storage and processing stability
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