Aluminum-based
Aluminum alloy and its composite materials with low density, high specific strength, corrosion resistance and easy surface treatment, etc., is a cost-effective lightweight materials, in recent years, the market demand is strong, the application and development of aluminum alloy powder materials is on the rise.
BAg-36
Features:
Excellent process performance, moderate melting point, good wetting performance and gap filling performance, excellent strength, plasticity, conductivity, corrosion resistance and other properties
Application:
Packing:
Aluminum foil bag, iron drum, plastic drum, woven bag, pallet, customized packaging
Date of delivery:
Precision grinding, intelligent manufacturing technology, integrated solutions
3-15 days
key word:
Model：BAg-36
- BAg45CuZnSn - BAg-36（AWS） - AG104（EN）
- Ag 145（ISO）
Silver solder is a commonly used high-temperature solder, and its melting temperature usually ranges from 600°C to 800°C. Silver solder has good wettability and diffusivity, and can quickly melt and fill the gaps in the joint during the brazing process.
Silver solder is widely used in electronics, aerospace, chemical industry and other fields to connect high-temperature and high-demand metal parts.
Chemical composition（wt%）
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牌号 Code |
成分组成Composition(Wt%) |
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Ag |
Cu |
Zn |
Sn |
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BAg45CuZnSn |
44-46 |
26-28 |
23.5-27.5 |
2.0-3.0 |
Physical indicators
【固液线Solidus and liquidus】640-680℃
【钎焊温度Brazing Temperature】677-813℃
【粉末规格Powder specifications（mesh）】-200、-300
Application areas
Air conditioning and refrigeration equipment
High strength, good plasticity and corrosion resistance, excellent electrical conductivity
Jewelry
Excellent process performance, beautiful appearance
Food equipment
Excellent conductivity and corrosion resistance, green and environmentally friendly, lower silver content, more economical
Brazing between copper, brass and black metal, hard alloy
Excellent process performance, moderate melting point, good wettability and joint filling performance
Recommend products
Gas atomization process, spherical powder, low oxygen content, particle size controllable, low density
View Details
1. Active Brazing: Titanium element removes the oxide film, achieving a high-strength metallurgical bond between ceramic and metal. 2. High Heat Resistance: The braze joint can withstand temperatures above 600℃, and has excellent thermal shock resistance. 3. Morphological Adaptability: Powder: Ultra-fine particle size (5-25μm), high purity, suitable for precision pre-placement processes. Paste: Contains low-volatility organic carriers, uniform coating, suitable for welding complex structures. 4. Strong Wettability: Excellent wettability for alumina, aluminum nitride ceramics, and refractory metals.
View Details
1. Ultra-high purity: Silver content ≥99.95%, total impurities ≤500 ppm 2. Spherical morphology: sphericity >95%, good fluidity, suitable for screen printing, spraying and other processes 3. High conductivity/thermal conductivity: volume resistivity ≤1.6 μΩ·cm, thermal conductivity ≥420 W/(m·K) 4. Controllable particle size: standard particle size 0.1-20μm (customizable), low specific surface area, high sintering activity 5. Oxidation resistance: surface coated with anti-oxidation layer (optional), extending storage and processing stability
View Details
1. Low-temperature brazing: Liquidus temperature of approximately 620℃, reducing the risk of damage to heat-sensitive components. 2. High electrical/thermal conductivity: Low solder joint resistivity, suitable for electronic components and conductive contact welding. 3. Morphological adaptability: Powder: Uniform particle size (20-75μm), good fluidity, suitable for automatic powder feeding or pre-placement processes; Paste: Contains environmentally friendly organic carriers, strong adhesion, convenient for manual coating. 4. Strong corrosion resistance: Excellent oxidation and sulfurization resistance of the solder joint, extending component life.
View DetailsMaybe you want to know something else.
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