Other materials
3D Printing、MIM、HIP、Brazing、Spraying、Porous material、PM
AgCuInTi
Features:
Gas atomization process, spherical powder, low oxygen content, particle size controllable, low density
Application:
PM (powder metallurgy)
Packing:
Precision grinding, intelligent manufacturing technology, integrated solutions
Aluminum foil bag, iron drum, plastic drum, woven bag, pallet, customized packaging
Date of delivery:
Precision grinding, intelligent manufacturing technology, integrated solutions
3-15 days
key word:
Model: AgCuInTi
Chemical composition（wt%）
|
Code |
Ag |
Cu |
In |
Ti |
Melting Temperature Range（℃） |
|
|
Solidus |
Liquidus |
|||||
|
AgCuInTiPowder |
42.6-44.6 |
28.1-30.1 |
23.3-25.3 |
2.0-5.0 |
540 |
650 |
Physical indicators
【Solidus】540-650℃
【Brazing Temperature】650-800℃
【Partice Size（Mesh）】-200，-300
Application areas
Aerospace
High strength, excellent corrosion resistance and high temperature stability and other performance.
Electronic and electrical
High strength, excellent electrical conductivity
Brazing
Silver-based active brazing material has good wettability and is suitable for vacuum brazing connections of the following material combinations: diamond/carbon/graphite-metal, ceramic-ceramic, ceramic-metal, metal-metal brazing, etc.
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1. Active Brazing: Titanium element breaks the oxide film, achieving high-strength metallurgical bonding between ceramic and metal. 2. High Heat Resistance: The brazing seam can withstand temperatures above 600°C, with excellent thermal shock resistance. 3. Morphological Adaptability: Powder form: ultra-fine particle size, high purity, suitable for precision preset processes. Paste form: contains low-volatility organic carriers, uniform coating, suitable for welding complex structures. 4. Strong Wettability: Excellent wettability to alumina, aluminum nitride ceramics, and refractory metals.
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1. Ultra-high purity: Silver content ≥99.95%, total impurities ≤500 ppm 2. Spherical morphology: sphericity >95%, good fluidity, suitable for screen printing, spraying and other processes 3. High conductivity/thermal conductivity: volume resistivity ≤1.6 μΩ·cm, thermal conductivity ≥420 W/(m·K) 4. Controllable particle size: standard particle size 0.1-20μm (customizable), low specific surface area, high sintering activity 5. Oxidation resistance: surface coated with anti-oxidation layer (optional), extending storage and processing stability
View DetailsMaybe you want to know something else.
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