Other materials
3D Printing、MIM、HIP、Brazing、Spraying、Porous material、PM
AgCuInTi
Features:
Gas atomization process, spherical powder, low oxygen content, particle size controllable, low density
Application:
PM (powder metallurgy)
Packing:
Precision grinding, intelligent manufacturing technology, integrated solutions
Aluminum foil bag, iron drum, plastic drum, woven bag, pallet, customized packaging
Date of delivery:
Precision grinding, intelligent manufacturing technology, integrated solutions
3-15 days
key word:
Model: AgCuInTi
Chemical composition（wt%）
|
Code |
Ag |
Cu |
In |
Ti |
Melting Temperature Range（℃） |
|
|
Solidus |
Liquidus |
|||||
|
AgCuInTiPowder |
42.6-44.6 |
28.1-30.1 |
23.3-25.3 |
2.0-5.0 |
540 |
650 |
Physical indicators
【Solidus】540-650℃
【Brazing Temperature】650-800℃
【Partice Size（Mesh）】-200，-300
Application areas
Aerospace
High strength, excellent corrosion resistance and high temperature stability and other performance.
Electronic and electrical
High strength, excellent electrical conductivity
Brazing
Silver-based active brazing material has good wettability and is suitable for vacuum brazing connections of the following material combinations: diamond/carbon/graphite-metal, ceramic-ceramic, ceramic-metal, metal-metal brazing, etc.
Recommend products
1. Low-temperature brazing: Liquidus temperature of approximately 620℃, reducing the risk of damage to heat-sensitive components. 2. High electrical/thermal conductivity: Low solder joint resistivity, suitable for electronic components and conductive contact welding. 3. Morphological adaptability: Powder: Uniform particle size (20-75μm), good fluidity, suitable for automatic powder feeding or pre-placement processes; Paste: Contains environmentally friendly organic carriers, strong adhesion, convenient for manual coating. 4. Strong corrosion resistance: Excellent oxidation and sulfurization resistance of the solder joint, extending component life.
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1. High Electrical/Thermal Conductivity: 72% silver content, low solder joint resistivity, suitable for welding precision electronic contacts and conductive components. 2. Corrosion Resistance and Oxidation Resistance: Excellent stability of solder joints in humid and high-temperature environments, extending equipment life. 3. Flexible Forms: Powder: Uniform particle size (15-50μm), good fluidity, suitable for automated powder feeding processes. Paste: Contains environmentally friendly adhesives, convenient coating, strong adhesion. 4. Excellent Wettability: Fully wets base materials such as copper and stainless steel, resulting in dense, pore-free welds.
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1. Active Brazing: Titanium element removes the oxide film, achieving a high-strength metallurgical bond between ceramic and metal. 2. High Heat Resistance: The braze joint can withstand temperatures above 600℃, and has excellent thermal shock resistance. 3. Morphological Adaptability: Powder: Ultra-fine particle size (5-25μm), high purity, suitable for precision pre-placement processes. Paste: Contains low-volatility organic carriers, uniform coating, suitable for welding complex structures. 4. Strong Wettability: Excellent wettability for alumina, aluminum nitride ceramics, and refractory metals.
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1. Ultra-high purity: Silver content ≥99.95%, total impurities ≤500 ppm 2. Spherical morphology: sphericity >95%, good fluidity, suitable for screen printing, spraying and other processes 3. High conductivity/thermal conductivity: volume resistivity ≤1.6 μΩ·cm, thermal conductivity ≥420 W/(m·K) 4. Controllable particle size: standard particle size 0.1-20μm (customizable), low specific surface area, high sintering activity 5. Oxidation resistance: surface coated with anti-oxidation layer (optional), extending storage and processing stability
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