Other materials
3D Printing、MIM、HIP、Brazing、Spraying、Porous material、PM
1. Superior High-Temperature Performance: Brazing temperature range of 1050-1200°C, joint temperature resistance up to 980°C. Resistant to high-temperature oxidation and heat corrosion, with excellent compatibility with nickel-based/cobalt-based alloys. 2. High Wettability and Fluidity: Containing boron and silicon elements, it lowers the melting point and enhances the wetting and penetration ability to stainless steel and high-temperature alloys. 3. Flexible Forms to Adapt to Processes: Paste: Convenient pre-placement, suitable for brazing complex structures (such as honeycomb seals). Powder: Can be sprayed or pre-coated, suitable for automated production lines. Foil: Uniform thickness (0.05-0.2mm), precision assembly without splashing.
1. High-Temperature and Corrosion Resistance Temperature range: -200°C to 1000°C, oxidation and sulfidation corrosion resistance. Resistant to seawater, chlorides, and acidic media corrosion, suitable for marine and chemical environments. 2. Excellent Processability High sphericity (≥98%), low oxygen content (≤0.1%), good fluidity, reducing 3D printing defects. Strong bonding strength with the substrate, supporting the formation of high-precision complex structures. 3. High Strength and Toughness Room temperature tensile strength ≥900 MPa, maintaining excellent mechanical properties at high temperatures.
1. High-Temperature Performance Applicable temperature range: -250°C to 700°C, resistant to high-temperature oxidation, creep, and sulfide corrosion. Strength is significantly improved after age hardening (room temperature tensile strength ≥ 1300 MPa). 2. Corrosion Resistance Resistant to acids, alkalis, chlorides, and seawater corrosion, suitable for chemical, marine, and nuclear industries. 3. Process Compatibility High sphericity (≥97%), low oxygen content (≤0.1%), excellent fluidity, compatible with additive manufacturing processes such as SLM (Selective Laser Melting) and EBM (Electron Beam Melting). No tendency for cracking after welding, supports the precision forming of complex structures.
1. Physical Properties: White or pale yellow powder, density ~4.6 g/cm³, melting point approximately 1485°C, insoluble in water. 2. Chemical Stability: Acid-resistant, high-temperature oxidation-resistant, slowly dissolves in strong alkalis. 3. Functional Characteristics: High dielectric constant (ε≈40), suitable for electronic ceramics. Excellent photocatalytic activity, can be used to degrade pollutants. Semiconductor properties (band gap ~3.4 eV), suitable for optoelectronic materials. 4. Controllable Morphology: Micrometer to nanometer powders are available, supporting customized morphologies such as spherical and flake-like shapes.
1. High strength and toughness: The weld is dense, with high tensile strength and impact resistance. 2. Corrosion resistance: It has good resistance to acids, alkalis, and high-temperature oxidation environments. 3. Low melting point: Brazing temperature range 780~850℃ (adjustable), suitable for a variety of substrates. 4. Good fluidity: Strong wettability, uniform weld filling, and low porosity.
1. Low melting point: brazing temperature range 620~750℃, energy-efficient and highly effective. 2. Strong wettability: good fluidity, can fill complex welds, and ensure firm bonding. 3. Corrosion resistance: resistant to water vapor and weak acid-base environments, extending the service life of workpieces. 4. Economic efficiency: moderate silver content, high cost performance, suitable for mass production.
1. Excellent Process Performance: Moderate melting point (approximately 880~910℃), good fluidity, easy to fill weld seams. 2. Strong and Tough Bonding: High brazing joint strength, good resistance to vibration and fatigue. 3. Strong Corrosion Resistance: Good corrosion resistance to water, steam, and weakly acidic media. 4. Wide Adaptability: Compatible with various base materials and processes such as flame brazing and induction brazing.
1. Ultrafine particle size: Nano-scale (50-200 nm) or submicron-scale (0.2-1 μm) optional, large specific surface area, high reactivity. 2. High purity and low oxygen content: Purity ≥99.99%, oxygen content ≤0.05%, excellent chemical stability. 3. Low-temperature processability: Low melting point characteristics are suitable for low-temperature sintering and melting molding processes, reducing energy consumption and equipment requirements. 4. Environmentally friendly and safe: Non-toxic and harmless, conforming to RoHS standards, replacing lead-based materials in medical and electronic fields.
1. Self-fluxing function: Phosphorus generates phosphate during brazing, reducing oxidation and eliminating the need for additional flux. 2. Low melting point and easy operation: Solidus temperature is approximately 645℃, liquidus temperature is approximately 815℃, suitable for heat-sensitive workpieces. 3. High conductivity: The conductivity of the brazed joint is close to that of pure copper, ensuring reliable electrical connection. 4. Excellent wettability: It wets copper, brass and other base materials thoroughly, resulting in a dense, pore-free weld.
1. High Electrical and Thermal Conductivity: The surface silver layer provides silver-like conductivity (resistivity ≤2.5 × 10⁻⁶ Ω·m) 2. Strong Oxidation Resistance: The silver layer isolates the copper substrate from oxidation, extending the material's stability 3. Cost Advantage: Significantly reduces the amount of precious metals used, with a higher price-performance ratio than pure silver powder 4. Process Adaptability: Compatible with various processing methods such as cold pressing and sintering, spraying, and paste printing
High purity, high hardness, wear resistance and corrosion resistance, low friction coefficient, excellent self-melting, wettability and spray welding, high sphericity, low oxygen, smooth surface, uniform particle size distribution, excellent flow properti
High purity, ultra-fine powder, white, light yellow or light gray tetragonal, hexagonal or rhombic crystal system powder
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