Other materials
3D Printing、MIM、HIP、Brazing、Spraying、Porous material、PM
1. Ultra-high purity: Silver content ≥99.95%, total impurities ≤500 ppm 2. Spherical morphology: sphericity >95%, good fluidity, suitable for screen printing, spraying and other processes 3. High conductivity/thermal conductivity: volume resistivity ≤1.6 μΩ·cm, thermal conductivity ≥420 W/(m·K) 4. Controllable particle size: standard particle size 0.1-20μm (customizable), low specific surface area, high sintering activity 5. Oxidation resistance: surface coated with anti-oxidation layer (optional), extending storage and processing stability
1. Active brazing: Titanium element removes the oxide film on the surface of ceramics/hard alloys, achieving high-strength heterogeneous material connection. 2. High thermal conductivity: The brazing seam has excellent thermal conductivity, suitable for heat sinks and high-temperature components. 3. Cost-effective: Copper-based alloys are low in cost, stable in performance, and have outstanding cost-effectiveness. 4. Flexible morphology: Powder: Fine particle size (10-50μm), good fluidity, suitable for automatic powder feeding process. Paste: Contains low-residue adhesive, convenient coating, strong adhesion. 5. Corrosion resistance: The brazing seam is oxidation-resistant and acid-alkali corrosion-resistant, extending the service life of components.
1. Self-fluxing function: Phosphorus effectively breaks down the oxide film, reduces the use of additional fluxes, and ensures clean brazing seams. 2. Low-temperature high efficiency: Liquidus temperature is approximately 640℃, reducing heat input and minimizing base material deformation. 3. Strong corrosion resistance: The brazing seam is oxidation-resistant and withstands humid environments, extending component service life. 4. Form adaptability: Powder: Uniform particle size (20-75μm), excellent flowability, suitable for automated powder feeding processes. Paste: Contains environmentally friendly bonding agents, easy to apply, and exhibits strong adhesion. 5. Economical and practical: Low cost of copper-based alloys, suitable for large-scale industrial production.
Excellent dielectric properties, high oxygen mobility, large energy gap, high refractive index, significant photoconductivity and photoluminescence, it is a widely used functional material
1. Unique Spherical Morphology: Particles are uniformly spherical with a smooth surface and excellent flowability, suitable for precision 3D printing, powder metallurgy, and other processes. High sphericity (≥95%), high packing density, reduced processing porosity, and improved material uniformity. 2. Low Melting Point and Easy Processing: Melting point is only 271.5℃, allowing for low-temperature sintering or melt molding, reducing energy consumption and equipment requirements. 3. Environmentally Friendly and Non-toxic: Completely replaces traditional lead-containing materials, complying with RoHS and medical environmental protection standards, suitable for radiation protection and biomedical fields. 4. High Purity and Stability: Purity can reach 99.99%, low oxygen content (≤0.1%), stable chemical properties, and resistance to oxidation during long-term storage. 5. Multifunctional Adaptability: Customizable particle size (10-100μm), surface modification (such as anti-oxidation coating), full
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