Other materials
3D Printing、MIM、HIP、Brazing、Spraying、Porous material、PM
It has high-strength and high toughness as well as good high temperature properties and corrosion resistance and good welding performance that can fill the small gap connector, we suggest the joint gap is 0.025-0.075mm
Strong corrosion resistance (resistance to oxidizing solutions containing chloride ions), properties of excellent high temperature performance, high strength, good oxidation resistance and mechanical performance
Low melting point, good wettability and fatigue resistance, the volume of the welding material expands slightly when solidifying, which is beneficial to eliminating shrinkage cavities; low melting point, suitable for packaging of electronic components tha
Similar with the eutectic composition of copper phosphorus, low welding temperature, The flowability of solder is very excellent, suitable for small junction of solder gaps, and formed very small solder angle after solder
High strength, good wettability for substrate, properties of excellent welding performance, electrical conductivity, corrosion resistance and processability
Centrifugal atomization process, low melting point, high purity, high sphericity rate, uniform particle size distribution, quality stable
High purity, high specific surface area, good flowability, excellent compatibility and electrical conductivity
Nitrogen atomization process, high alloying purity, high sphericity rate, controllable particle size distribution, powder particle size siftable
Gas atomization process, spherical powder, low oxygen content, uniform particle distribution, high apparent density, good flowability
Gas atomization process, high density, high purity, good flowability, uniform particle distribution
Gas atomization process, spherical powder, low oxygen content, uniform particle distribution, high density, good flowability
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