BCu92P
Features:
Similar with the eutectic composition of copper phosphorus, low welding temperature, The flowability of solder is very excellent, suitable for small junction of solder gaps, and formed very small solder angle after solder
Application:
Packing:
Precision grinding, intelligent manufacturing technology, integrated solutions
Aluminum foil bag, iron drum, plastic drum, woven bag, pallet, customized packaging
Date of delivery:
Precision grinding, intelligent manufacturing technology, integrated solutions
3-15 days
key word:
Chemical composition(wt%)
Code |
Chemical Composition(wt%) |
|
|
Cu |
P |
|
|
|
BCu92P |
Bal. |
7.5-8.1 |
Physical indicators
【Solid-liquid line】 710-770 ℃
【Solder temperature】 720-843 ℃
【Specifications (Mesh)】 -50, -100, -300
Application areas

Electronic component
It has high conductivity and thermal conductivity, and is suitable for manufacturing electronic components, wires, cables, and other products that high conductivity and high thermal conductivity

Electric manufacturing
Close to eutectic composition of copper phosphorus and have a low melting point and good wettability. It can flow into the small soldering gap , and the price of the solder material is cheap

Refrigeration industry
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