Other materials

3D Printing、MIM、HIP、Brazing、Spraying、Porous material、PM

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  • BCu92P铜基钎料 (1).jpg
  • BCu92P铜磷焊膏.jpg
  • BCu92P电镜图-水印.jpg

BCu92P


Features:

Similar with the eutectic composition of copper phosphorus, low welding temperature, The flowability of solder is very excellent, suitable for small junction of solder gaps, and formed very small solder angle after solder

Application:

Normally apply to industries such as mechanical and electrical, instrumentation, refrigeration. bronze and brass components that are not impact loaded

Packing:

Precision grinding, intelligent manufacturing technology, integrated solutions

Aluminum foil bag, iron drum, plastic drum, woven bag, pallet, customized packaging

Date of delivery:

Precision grinding, intelligent manufacturing technology, integrated solutions

3-15 days

key word:



Chemical composition(wt%)

 

Code

Chemical Compositionwt%

 

Cu

P

 

 

 

BCu92P

Bal.

7.5-8.1

Physical indicators

Solid-liquid line 710-770 ℃

Solder temperature720-843 ℃

Specifications (Mesh)-50, -100, -300

Application areas

Electronic component

Electronic component

It has high conductivity and thermal conductivity, and is suitable for manufacturing electronic components, wires, cables, and other products that high conductivity and high thermal conductivity

Electric manufacturing

Electric manufacturing

Close to eutectic composition of copper phosphorus and have a low melting point and good wettability. It can flow into the small soldering gap , and the price of the solder material is cheap

Refrigeration industry

Refrigeration industry

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Product customization

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