Other materials
3D Printing、MIM、HIP、Brazing、Spraying、Porous material、PM
BCu92P
Features:
Similar with the eutectic composition of copper phosphorus, low welding temperature, The flowability of solder is very excellent, suitable for small junction of solder gaps, and formed very small solder angle after solder
Application:
Packing:
Precision grinding, intelligent manufacturing technology, integrated solutions
Aluminum foil bag, iron drum, plastic drum, woven bag, pallet, customized packaging
Date of delivery:
Precision grinding, intelligent manufacturing technology, integrated solutions
3-15 days
key word:
Chemical composition（wt%）
|
Code |
Chemical Composition（wt%） |
|
|
|
Cu |
P |
|
|
|
|
|
BCu92P |
Bal. |
7.5-8.1 |
Physical indicators
【Solid-liquid line】 710-770 ℃
【Solder temperature】 720-843 ℃
【Specifications (Mesh)】 -50, -100, -300
Application areas
Electronic component
It has high conductivity and thermal conductivity, and is suitable for manufacturing electronic components, wires, cables, and other products that high conductivity and high thermal conductivity
Electric manufacturing
Close to eutectic composition of copper phosphorus and have a low melting point and good wettability. It can flow into the small soldering gap , and the price of the solder material is cheap
Refrigeration industry
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1. Active brazing: Titanium element removes the oxide film on the surface of ceramics/hard alloys, achieving high-strength heterogeneous material connection. 2. High thermal conductivity: The brazing seam has excellent thermal conductivity, suitable for heat sinks and high-temperature components. 3. Cost-effective: Copper-based alloys are low in cost, stable in performance, and have outstanding cost-effectiveness. 4. Flexible morphology: Powder: Fine particle size (10-50μm), good fluidity, suitable for automatic powder feeding process. Paste: Contains low-residue adhesive, convenient coating, strong adhesion. 5. Corrosion resistance: The brazing seam is oxidation-resistant and acid-alkali corrosion-resistant, extending the service life of components.
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CuSn15.6P5.2Ni4.2 is the copper-phosphorus based brazing alloy with the lowest melting temperature and excellent fluidity. It is suitable for tight-fitting joints, producing full and aesthetically pleasing brazed seams. When brazing pure copper, it has a self-fluxing function and does not require additional flux, making it more economical than silver brazing alloys.
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