Other materials
3D Printing、MIM、HIP、Brazing、Spraying、Porous material、PM
CuSnTi
Features:
1. Active brazing: Titanium element removes the oxide film on the surface of ceramics/hard alloys, achieving high-strength heterogeneous material connection. 2. High thermal conductivity: The brazing seam has excellent thermal conductivity, suitable for heat sinks and high-temperature components. 3. Cost-effective: Copper-based alloys are low in cost, stable in performance, and have outstanding cost-effectiveness. 4. Flexible morphology: Powder: Fine particle size (10-50μm), good fluidity, suitable for automatic powder feeding process. Paste: Contains low-residue adhesive, convenient coating, strong adhesion. 5. Corrosion resistance: The brazing seam is oxidation-resistant and acid-alkali corrosion-resistant, extending the service life of components.
Application:
Cubic boron nitride
Alloy steel
Ceramic materials
Widely used in the brazing of superhard tool materials, such as diamond grinding heads, wire saws, carving knives, grinding wheels, saw blades, CBN, and PCBN tools.
Packing:
Precision grinding, intelligent manufacturing technology, integrated solutions
Aluminum foil bag, iron drum, plastic drum, woven bag, pallet, customized packaging
Date of delivery:
Precision grinding, intelligent manufacturing technology, integrated solutions
3-15 days
key word:
Product Name: CuSnTi Copper Tin Titanium Brazing Filler Metal
Chemical composition（wt%）
| Solder Grade (GB/T 6418-2008) | Chemical Composition (Wt/%) | Other | Melting Temperature Range (Reference Value) ℃ | Liquidus | Corresponding ISO Model | |
| Cu | P | Solidus | ||||
| CuP5（BCu95P） | BAl. | 4.8-5.3 | - | 710 | 925 | CuP178 |
| CuP6(BCu94P) | BAl. | 5.9-6.5 | - | 710 | 8920 | CuP179 |
| CuP7（BCu93P-B） | BAl. | 6.6-7.4 | - | 710 | 820 | CuP182 |
| CuP8（BCu92P） | BAl. | 7.5-8.1 | - | 710 | 770 | CuP181a |
| BCu87PSn(Si) | BAl. | 6.0-7.0 | Sn 6.0-7.0 Si 0.01-0.04 | 635 | 675 | CuP385 |
| CuPSn-3-7 | BAl. | 6.4-7.2 | Sn 2.5-3.5 | 660 | 710 | - |
| CuPSn-7-7(BCu86SnP) | BAl. | 6.4-7.2 | Sn 6.5-7.5 | 650 | 700 | CuP385a |
| BCu86SnPNi | BAl. | 4.8-5.8 | Sn 7.0-8.0 Ni 0.4-1.2 | 620 | 670 | - |
| BCu92PSb | BAl. | 5.6-6.4 | Sb 1.8-2.2 | 690 | 825 | CuP389 |
| BCu92PAg | BAl. | 5.9-6.7 | Ag 1.5-2.5 | 645 | 825 | CuP279 |
| BCu88PAg | BAl. | 6.5-7.0 | Ag 4.8-5.2 | 643 | 771 | CuP282 |
| BFe10-1-1 | BAl. | <0.006 | Ni 9-11 Fe 1.0-1.5 Mn 0.5-1.0 Si <0.15 | 1100 | 1150 | CuNi10FeMn |
| CuSnTi | BAl. | - | Sn 18-20 Ti 9-11 | 850 | 880 | - |
Physical indicators
Solid-liquid line: 850-880℃
Brazing temperature: 880-930℃
Specification (-mesh): -200, -50, +200
Application areas
Brazing Material
Aerospace
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