Other materials

3D Printing、MIM、HIP、Brazing、Spraying、Porous material、PM

Code:CuSn3P7

- CuSn3P7

- CuP7Sn3

Inquire Now for Free Samples

Fill out the form on the right or contact us directly; we will provide product samples, technical data sheets, and price quotes to help you quickly complete your additive manufacturing process validation.

WhatsApp:+86 181 4263 6992

E-mail: sales01@hntijo.com

Address: No.39, Liandong Yougu lnd. Park, Bachelor Street,Changsha City,Hunan Province, China.

Recommend products

BCu92P

Similar with the eutectic composition of copper phosphorus, low welding temperature, The flowability of solder is very excellent, suitable for small junction of solder gaps, and formed very small solder angle after solder

View Details

CuMnNi

High strength, good wettability for substrate, properties of excellent welding performance, electrical conductivity, corrosion resistance and processability

View Details

CuSn20

Low melting point, good compactability, easy sintering; excellent strength、thermal conductivity、wear resistance 、color and lustre

View Details

Spherical Copper Powder

Gas atomization process, high density, high purity, good flowability, uniform particle distribution

View Details
All
  • All
  • Product Management
  • News
  • Introduction
  • Enterprise outlets
  • FAQ
  • Enterprise Video
  • Enterprise Atlas

316L、17-4PH、304L、MS1、FeSi6.5、FeCrAl、HK30、430