Other materials
3D Printing、MIM、HIP、Brazing、Spraying、Porous material、PM
Spherical Copper Powder
Features:
Gas atomization process, high density, high purity, good flowability, uniform particle distribution
Application:
Metal Injection Molding
Spraying
Laser Cladding
Brazing
PM Powder Metallurgy
Packing:
Precision grinding, intelligent manufacturing technology, integrated solutions
Aluminum foil bag, iron drum, plastic drum, woven bag, pallet, customized packaging
Date of delivery:
Precision grinding, intelligent manufacturing technology, integrated solutions
3-15 days
key word:
Model: Spherical copper powder
Application of pure copper powder
1. Electronic industry
Manufacturing electronic components
2. Powder metallurgy
Manufacturing mechanical parts, such as gears, bearings, pump bodies
3. Aerospace
Manufacturing aircraft engine components, rocket combustion chamber linings
4. Additive manufacturing
5. Catalyst
Can increase the speed of chemical reactions, improve selectivity and control the directionality of reactions, chemicals, pharmaceuticals, plastics, pigments, etc.
6. Conductive materials
Manufacturing contact materials, semiconductor packaging materials, stainless steel filling materials, widely used in electronics, construction, aviation, chemicals, printing, military
7. Electromagnetic shielding materials
Chemical composition（wt%）
|
Code |
≮ |
≯（ppm）oxygen content |
|||||||||||||
|
Cu |
Fe |
Pb |
Zn |
As |
Sb |
Bi |
Ni |
Sn |
P |
S |
C |
Hydrogen Loss |
Nitric acid insoluble matter
|
Sum |
|
|
Copper powder |
99.6 |
200 |
200 |
40 |
50 |
50 |
20 |
100 |
40 |
100 |
40 |
40 |
2500 |
500 |
4000 |
Application areas
Chemical Industry
Used in manufacture of catalysts, adsorbents and preservatives
Brazing
Good machinability and weldability, easy processability and weldability properties
Electronic Aviation
High strength and high conductivity properties, used in the manufacture of functional and structural components of aerospace spacecraft
Electromechanical parts
Used to manufacture motors, transformers, wires and cables
Metallic Paint
Rich color, bright luster
Electronic Material
Good electrical and thermal conductivity property
Recommend products
1. Active brazing: Titanium element removes the oxide film on the surface of ceramics/hard alloys, achieving high-strength heterogeneous material connection. 2. High thermal conductivity: The brazing seam has excellent thermal conductivity, suitable for heat sinks and high-temperature components. 3. Cost-effective: Copper-based alloys are low in cost, stable in performance, and have outstanding cost-effectiveness. 4. Flexible morphology: Powder: Fine particle size (10-50μm), good fluidity, suitable for automatic powder feeding process. Paste: Contains low-residue adhesive, convenient coating, strong adhesion. 5. Corrosion resistance: The brazing seam is oxidation-resistant and acid-alkali corrosion-resistant, extending the service life of components.
View Details
CuSn15.6P5.2Ni4.2 is the copper-phosphorus based brazing alloy with the lowest melting temperature and excellent fluidity. It is suitable for tight-fitting joints, producing full and aesthetically pleasing brazed seams. When brazing pure copper, it has a self-fluxing function and does not require additional flux, making it more economical than silver brazing alloys.
View DetailsMaybe you want to know something else.
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