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  • CuSn20铜合金粉 (2).jpg
  • CuSn20电镜图.jpg

CuSn20


Features:

Low melting point, good compactability, easy sintering; excellent strength、thermal conductivity、wear resistance 、color and lustre

Application:

Commonly used for welding diamond, ceramics and other non-metals, widely used in geological drill, machine tool guide soft belt, seals, friction materials, etc

Packing:

Precision grinding, intelligent manufacturing technology, integrated solutions

Aluminum foil bag, iron drum, plastic drum, woven bag, pallet, customized packaging

Date of delivery:

Precision grinding, intelligent manufacturing technology, integrated solutions

3-15 days

key word:



Code:CuSn20、CuSn10

- CuSn20  - Cu80Sn20   -CuSn10

In the electronics industry and the power industry, CuZn30 copper-based alloy powder can be used to manufacture conductive adhesives, conductive inks, electrode materials, etc., to ensure the stability and performance of the products;
In the fields of chemical engineering, marine engineering, and construction, CuZn30 copper-based alloy powder can be used to manufacture anti-corrosion coatings, anti-corrosion pipelines, corrosion-resistant components, etc., to provide long-term and reliable protection;
Through pressing, injection molding, sintering and other processes, CuZn30 copper alloy powder can be used to manufacture precision parts and engineering components to improve the accuracy and reliability of products.

 

Chemical composition(wt%)

 

Code

Chemical Compositionwt%

Cu

Sn

CuSn10

Bal.

9.5-10.5

CuSn15

Bal.

14.5-15.5

CuSn20

Bal.

19.5-20.5

CuSn33

Bal.

32.5-33.5

Physical indicators

牌号

Code

熔化温度范围melting range

钎焊温度Brazing Temperature

 

固相线Solidus

液相线Liquidus

 

CuSn10

840

1040

1020-1050

CuSn20

800

915

830-980

Application areas

Diamond Tool

Diamond Tool

Properties of strong binding force, good wear resistance and low sintering temperature in the copper-tin alloy

Diamond welding circular saw blade

Diamond welding circular saw blade

After the alloy powder particles are melted at high temperature, it is filling in the capillary channels among particles under the action of capillary force. Due to the excellent wettability between tin and metal, liquid tin spreads rapidly on the surface of metal particles, tin is diffused into the powder particles forming a sintered dense tool head

Recommend products

Spherical Copper Powder

Gas atomization process, high density, high purity, good flowability, uniform particle distribution

View Details

CuSnTi

1. Active brazing: Titanium element removes the oxide film on the surface of ceramics/hard alloys, achieving high-strength heterogeneous material connection. 2. High thermal conductivity: The brazing seam has excellent thermal conductivity, suitable for heat sinks and high-temperature components. 3. Cost-effective: Copper-based alloys are low in cost, stable in performance, and have outstanding cost-effectiveness. 4. Flexible morphology: Powder: Fine particle size (10-50μm), good fluidity, suitable for automatic powder feeding process. Paste: Contains low-residue adhesive, convenient coating, strong adhesion. 5. Corrosion resistance: The brazing seam is oxidation-resistant and acid-alkali corrosion-resistant, extending the service life of components.

View Details

CuSnPNi

1. Self-fluxing function: Phosphorus effectively breaks down the oxide film, reduces the use of additional fluxes, and ensures clean brazing seams. 2. Low-temperature high efficiency: Liquidus temperature is approximately 640℃, reducing heat input and minimizing base material deformation. 3. Strong corrosion resistance: The brazing seam is oxidation-resistant and withstands humid environments, extending component service life. 4. Form adaptability: Powder: Uniform particle size (20-75μm), excellent flowability, suitable for automated powder feeding processes. Paste: Contains environmentally friendly bonding agents, easy to apply, and exhibits strong adhesion. 5. Economical and practical: Low cost of copper-based alloys, suitable for large-scale industrial production.

View Details

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