Other materials
3D Printing、MIM、HIP、Brazing、Spraying、Porous material、PM
SnBi58
Features:
Low melting point, good wettability and fatigue resistance, the volume of the welding material expands slightly when solidifying, which is beneficial to eliminating shrinkage cavities; low melting point, suitable for packaging of electronic components tha
Application:
Packing:
Precision grinding, intelligent manufacturing technology, integrated solutions
Aluminum foil bag, iron drum, plastic drum, woven bag, pallet, customized packaging
Date of delivery:
Precision grinding, intelligent manufacturing technology, integrated solutions
3-15 days
key word:
Code：SnBi58
Chemical composition（wt%）
|
Code |
Chemical composition（wt%） |
|||||||||
|
|
Sn |
Bi |
impurity |
|||||||
|
|
|
|
Pb |
Sb |
Cu |
Zn |
Ag |
Al |
As |
Au |
|
SnBi58 |
41.5- 42.5 |
57.5- 58.5 |
0.050 |
0.050 |
0.050 |
0.001 |
0.050 |
0.001 |
0.030 |
0.050 |
|
|
|
|
Cd |
Fe |
Ge |
Ni |
In |
|
|
|
|
|
|
|
0.002 |
0.020 |
0.050 |
0.010 |
0.050 |
|
|
|
Physical indicators
Application areas
Aerospace
High temperature resistance and corrosion resistance, can be used as turbine blade material for engines
Electronics Industry
Used for welding in the manufacture of various electronic components, circuit boards, mobile phones, laptops and other electronic products
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