Aluminum-based
Aluminum alloy and its composite materials with low density, high specific strength, corrosion resistance and easy surface treatment, etc., is a cost-effective lightweight materials, in recent years, the market demand is strong, the application and development of aluminum alloy powder materials is on the rise.
Spherical Tin Powder
Features:
Centrifugal atomization process, low melting point, high purity, high sphericity rate, uniform particle size distribution, quality stable
Application:
Packing:
Aluminum foil bag, iron drum, plastic drum, woven bag, pallet, customized packaging
Date of delivery:
Precision grinding, intelligent manufacturing technology, integrated solutions
3-15 days
key word:
Model: Spherical tin powder
Mainly used to make solder paste, electric carbon products, friction materials, oil-containing bearings and powder metallurgy structural materials.
Widely used in metallurgy, electronics, electrical appliances, chemicals, building materials, machinery and food packaging industries.
With the increase of environmental awareness, the non-toxic and environmentally friendly properties of tin powder will make it applicable to the packaging fields of medicine, chemicals, light industry, food, health care, art supplies, etc. in the future.
Chemical composition（wt%）
|
Code |
Chemical Composition（wt%） |
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|
|
Sn |
Impurity content ≤ |
||||||||
|
|
|
Pb |
Bi |
Sb |
Cu |
Zn |
Ag |
Al |
As |
Au |
|
Sn100 |
Bal. |
0.050 |
0.050 |
0.050 |
0.050 |
0.001 |
0.050 |
0.001 |
0.030 |
0.050 |
|
|
|
Cd |
Fe |
Ge |
Ni |
In |
|
|
|
|
|
|
|
0.002 |
0.020 |
0.050 |
0.010 |
0.050 |
|
|
|
|
Application areas
Brazing Industry
Main raw material for the production of solder paste, uniform particle size, suitable for solder welding industry, good fluidity, fine powder, able to improve the fineness of brazing paste
Diamond Tools
Increasing the holding force of the diamond matrix, improving cutting speed of the diamond, increasing sharpness of the diamond
Electronics Industry
High precision SMT solder joints used in IC circuit PCB board technology field
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1. Excellent Corrosion Resistance: High molybdenum (Mo) content enhances resistance to pitting and crevice corrosion, suitable for harsh environments such as marine and chemical applications. 2. Biocompatibility: Certified for biocompatibility according to ISO 10993, suitable for manufacturing medical devices and implants. 3. High Purity and Low Impurities: Oxygen content ≤0.1%, carbon content ≤0.03%, reducing printing defects and ensuring the density and strength of finished products. 4. Excellent Processing Performance: High sphericity (≥95%), good fluidity (Hall flow rate ≤25 s/50g), suitable for additive manufacturing processes such as SLM and EBM.
View Details
1. Ultra-high strength: After aging hardening, the tensile strength ≥1310 MPa, hardness HRC ≥40, excellent impact toughness. Performance is stable at low temperatures down to 300°C, and fatigue resistance is outstanding. 2. Corrosion resistance: Resistant to atmospheric, seawater, and weak acid corrosion; suitable for chemical and marine environments. Passivation or plating further improves corrosion resistance. 3. Processing adaptability: High sphericity (≥95%), low oxygen content (≤0.1%), excellent fluidity, suitable for 3D printing of complex structures. Small heat treatment deformation, supports precision machining and surface polishing.
View Details
1. Corrosion Resistance: Resistant to weak acids, alkalis, chlorides, and organic media corrosion. Its intergranular corrosion resistance is superior to 304 stainless steel. It exhibits good oxidation resistance and is suitable for humid and high-temperature steam environments. 2. Processing Adaptability: High sphericity (≥95%), low oxygen content (≤0.1%), and excellent fluidity reduce additive manufacturing defects. Excellent weldability, no annealing required after welding, and no tendency for hot cracking. 3. Environmental and Hygiene: Lead-free and cadmium-free, compliant with FDA and RoHS standards, suitable for food contact applications.
View Details
1. Ultra-high strength: Tensile strength ≥1900 MPa and hardness ≥50 HRC after aging treatment, suitable for high-load scenarios. 2. Excellent machinability: High sphericity (≥95%) and low oxygen content (≤0.1%), suitable for 3D printing and complex structure forming. 3. High-temperature performance: Good high-temperature stability, suitable for mold hot-working parts and parts used in high-temperature environments. 4. Heat treatment friendly: Can be rapidly strengthened by aging treatment (480-500℃) to improve mechanical properties.
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