Aluminum-based
Aluminum alloy and its composite materials with low density, high specific strength, corrosion resistance and easy surface treatment, etc., is a cost-effective lightweight materials, in recent years, the market demand is strong, the application and development of aluminum alloy powder materials is on the rise.
Silver-clad copper powder
Features:
1. High Electrical and Thermal Conductivity: The surface silver layer provides silver-like conductivity (resistivity ≤2.5 × 10⁻⁶ Ω·m) 2. Strong Oxidation Resistance: The silver layer isolates the copper substrate from oxidation, extending the material's stability 3. Cost Advantage: Significantly reduces the amount of precious metals used, with a higher price-performance ratio than pure silver powder 4. Process Adaptability: Compatible with various processing methods such as cold pressing and sintering, spraying, and paste printing
Application:
Used for preparing conductive printing inks
Used for preparing conductive adhesives
Used for preparing medium and low temperature pastes for membrane switches, can replace silver powder in the electronics industr
Packing:
Aluminum foil bag, iron drum, plastic drum, woven bag, pallet, customized packaging
Date of delivery:
Precision grinding, intelligent manufacturing technology, integrated solutions
3-15 days
key word:
Product Name: Silver Bag Copper Powder
Chemical composition（wt%）
|
Composition ComponentsComposition（wt%） |
||||||||
|
No. |
Specification |
Ag(wt%) |
Cu(wt%) |
BET(m²/g) |
D10(μm) |
D50(μm) |
D90(μm) |
|
|
1 |
CuAg-S0501 |
15-30 |
Bal. |
1.50-2.50 |
≤1.00 |
≤2.00 |
≤4.00 |
|
|
2 |
CuAg-S1001 |
10-30 |
Bal. |
0.45-0.65 |
≤2.50 |
≤4.00 |
≤5.50 |
|
|
3 |
CuAg-S3501 |
10-30 |
Bal. |
0.25-0.45 |
≤3.80 |
≤6.00 |
≤9.30 |
|
|
4 |
CuAg-F0501 |
15-30 |
Bal. |
1.90-2.00 |
≤1.70 |
≤3.70 |
≤5.60 |
|
|
5 |
CuAg-F1001 |
10-30 |
Bal. |
0.80-0.95 |
≤3.20 |
≤4.80 |
≤6.30 |
|
|
6 |
CuAg-F3501 |
20-30 |
Bal. |
0.55-0.75 |
≤3.50 |
≤5.80 |
≤7.50 |
|
Physical indicators
Application areas
Conductive paste
Conductive printing ink
Conductive adhesive
Low-temperature slurry
Substitute silver powder
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