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3D Printing、MIM、HIP、Brazing、Spraying、Porous material、PM

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  • BAg18CuP (7).jpg

Ag18CuP


Features:

Ternary eutectic solder, low temperature, good fluidity and process performance, will form brittle intermetallic compounds at the weld, cannot be used to connect ferrous metals, nickel-based alloys or nickel-copper alloys containing more than 10% nickel

Application:

Copper and copper alloy brazing, suitable for tight fitting joints, recommended joint gap size is 0.025-0.075mm

Packing:

Precision grinding, intelligent manufacturing technology, integrated solutions

Aluminum foil bag, iron drum, plastic drum, woven bag, pallet, customized packaging

Date of delivery:

Precision grinding, intelligent manufacturing technology, integrated solutions

3-15 days

key word:



Chemical composition(wt%)

code

Ag

Cu

P

Melting range

 

 

 

 

Solidus

Liquidus

Ag18CuP

17.0-19.0

Bal.

6.6-7.5

645

645

Physical indicators

Solidus and liquidus645

Brazing Temperature643-686

mesh-200-300

 

Application areas

Brazing of copper with copper alloy/molybdenum/tungsten

Brazing of copper with copper alloy/molybdenum/tungsten

Ternary eutectic filler metal, properties of low temperature, good fluidity and processability performance

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