Ag18CuP
Features:
Ternary eutectic solder, low temperature, good fluidity and process performance, will form brittle intermetallic compounds at the weld, cannot be used to connect ferrous metals, nickel-based alloys or nickel-copper alloys containing more than 10% nickel
Application:
Packing:
Precision grinding, intelligent manufacturing technology, integrated solutions
Aluminum foil bag, iron drum, plastic drum, woven bag, pallet, customized packaging
Date of delivery:
Precision grinding, intelligent manufacturing technology, integrated solutions
3-15 days
key word:
Chemical composition(wt%)
code |
Ag |
Cu |
P |
Melting range(℃) |
|
|
|
|
|
Solidus |
Liquidus |
Ag18CuP |
17.0-19.0 |
Bal. |
6.6-7.5 |
645 |
645 |
Physical indicators
【Solidus and liquidus】645℃
【Brazing Temperature】643-686℃
【(mesh)】-200,-300
Application areas

Brazing of copper with copper alloy/molybdenum/tungsten
Ternary eutectic filler metal, properties of low temperature, good fluidity and processability performance
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View Details