Other materials
3D Printing、MIM、HIP、Brazing、Spraying、Porous material、PM
BAg-8
Features:
1. High Electrical/Thermal Conductivity: 72% silver content, low solder joint resistivity, suitable for welding precision electronic contacts and conductive components. 2. Corrosion Resistance and Oxidation Resistance: Excellent stability of solder joints in humid and high-temperature environments, extending equipment life. 3. Flexible Forms: Powder: Uniform particle size (15-50μm), good fluidity, suitable for automated powder feeding processes. Paste: Contains environmentally friendly adhesives, convenient coating, strong adhesion. 4. Excellent Wettability: Fully wets base materials such as copper and stainless steel, resulting in dense, pore-free welds.
Application:
PM (powder metallurgy)
Packing:
Precision grinding, intelligent manufacturing technology, integrated solutions
Aluminum foil bag, iron drum, plastic drum, woven bag, pallet, customized packaging
Date of delivery:
Precision grinding, intelligent manufacturing technology, integrated solutions
3-15 days
key word:
Product Name: BAg72Cu Silver Copper Solder
Grade
- BAg72Cu（GB/T）
- Al 272（ISO）
- AG401（EN）
- BAg-8（AWS）
- BVAg-8（AWS）
Chemical composition（wt%）
Brand | Chemical Composition (wt%) | ||||||
≯ | Melting Temperature Range (℃) | ||||||
BAg72Cu | Ag | Cu | Cd | Si | Solidus | Liquidus | |
71.0-73.0 | 27-29 | 0.01 | 0.05 | 779 | 779 | ||
Physical indicators
Solid-Liquid Line: 779℃
Brazing Temperature: 779-899℃
Specification (mesh): -100+300，-300
Application areas
Stainless steel welding
The surface needs to be nickel plated to achieve better brazing effect.
Copper alloy welding
The silver-copper eutectic composition has a low welding temperature, good electrical conductivity, and does not contain volatile elements.
Vacuum welding materials
Excellent process performance, suitable melting point, good wettability, strong gap filling ability, and high welding quality, it can form high strength, high conductivity and corrosion-resistant brazed joints.
Recommend products
1. Ultra-high purity: Silver content ≥99.95%, total impurities ≤500 ppm 2. Spherical morphology: sphericity >95%, good fluidity, suitable for screen printing, spraying and other processes 3. High conductivity/thermal conductivity: volume resistivity ≤1.6 μΩ·cm, thermal conductivity ≥420 W/(m·K) 4. Controllable particle size: standard particle size 0.1-20μm (customizable), low specific surface area, high sintering activity 5. Oxidation resistance: surface coated with anti-oxidation layer (optional), extending storage and processing stability
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1. Low-temperature brazing: Liquidus temperature of approximately 620℃, reducing the risk of damage to heat-sensitive components. 2. High electrical/thermal conductivity: Low solder joint resistivity, suitable for electronic components and conductive contact welding. 3. Morphological adaptability: Powder: Uniform particle size (20-75μm), good fluidity, suitable for automatic powder feeding or pre-placement processes; Paste: Contains environmentally friendly organic carriers, strong adhesion, convenient for manual coating. 4. Strong corrosion resistance: Excellent oxidation and sulfurization resistance of the solder joint, extending component life.
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1. Active Brazing: Titanium element removes the oxide film, achieving a high-strength metallurgical bond between ceramic and metal. 2. High Heat Resistance: The braze joint can withstand temperatures above 600℃, and has excellent thermal shock resistance. 3. Morphological Adaptability: Powder: Ultra-fine particle size (5-25μm), high purity, suitable for precision pre-placement processes. Paste: Contains low-volatility organic carriers, uniform coating, suitable for welding complex structures. 4. Strong Wettability: Excellent wettability for alumina, aluminum nitride ceramics, and refractory metals.
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Contact Us
Address: No.39, Liandong Yougu lnd. Park, Bachelor Street,Changsha City,Hunan Province, China.
