Other materials
3D Printing、MIM、HIP、Brazing、Spraying、Porous material、PM
AgCuTi4.5
Features:
1. Active Brazing: Titanium element breaks the oxide film, achieving high-strength metallurgical bonding between ceramic and metal. 2. High Heat Resistance: The brazing seam can withstand temperatures above 600°C, with excellent thermal shock resistance. 3. Morphological Adaptability: Powder form: ultra-fine particle size, high purity, suitable for precision preset processes. Paste form: contains low-volatility organic carriers, uniform coating, suitable for welding complex structures. 4. Strong Wettability: Excellent wettability to alumina, aluminum nitride ceramics, and refractory metals.
Application:
Packing:
Precision grinding, intelligent manufacturing technology, integrated solutions
Aluminum foil bag, iron drum, plastic drum, woven bag, pallet, customized packaging
Date of delivery:
Precision grinding, intelligent manufacturing technology, integrated solutions
3-15 days
key word:
Product Name: AgCuTi4.5
Chemical composition（wt%）
Powder Grade | Chemical Composition | |||
Ag | Cu | Ti | O | |
AgCuTi4.5 | 68.7-70.7 | Balance | 4.0-5.0 | ≤0.05 |
Solder Paste Grade | Component Composition | |
Alloy Powder | Binder | |
AgCuTi4.5 | 80-90 | Balance |
Physical indicators
AgCuTi4.5 | |||||
Solid-liquid phase ℃ | Brazing temperature ℃ | Powder morphology | Loose density g/cm³ | Powder sieving ( Mesh ) | Other morphologies |
770-810 | 830-930 | Spherical | ≥3.5 | 100/300 | Powder / Paste / Foil |
Application areas
Brazing
Silver-based active brazing material has good wettability and is suitable for vacuum brazing connections of the following material combinations: diamond/carbon/graphite-metal, ceramic-ceramic, ceramic-metal, metal-metal brazing, etc.
Recommend products
1. Ultra-high purity: Silver content ≥99.95%, total impurities ≤500 ppm 2. Spherical morphology: sphericity >95%, good fluidity, suitable for screen printing, spraying and other processes 3. High conductivity/thermal conductivity: volume resistivity ≤1.6 μΩ·cm, thermal conductivity ≥420 W/(m·K) 4. Controllable particle size: standard particle size 0.1-20μm (customizable), low specific surface area, high sintering activity 5. Oxidation resistance: surface coated with anti-oxidation layer (optional), extending storage and processing stability
View Details
BAg-8 eutectic solder has a relatively low melting point, with solid and liquid phases close to each other, no crystallization gaps, and good thermal and electrical conductivity of the weld seam. The solder is clean, does not contain high vapor pressure or volatile elements, and has good processing performance.
View Details
Widely used for welding between ferrous and non-ferrous metals, it has good fluidity and wettability, a smooth surface, high joint strength, and an appearance color that matches stainless steel, making it an ideal replacement for Cd-containing brazing materials.
View DetailsMaybe you want to know something else.
Contact Us
Address: No.39, Liandong Yougu lnd. Park, Bachelor Street,Changsha City,Hunan Province, China.
