Other materials
3D Printing、MIM、HIP、Brazing、Spraying、Porous material、PM
AgCuTi
Features:
1. Active Brazing: Titanium element removes the oxide film, achieving a high-strength metallurgical bond between ceramic and metal. 2. High Heat Resistance: The braze joint can withstand temperatures above 600℃, and has excellent thermal shock resistance. 3. Morphological Adaptability: Powder: Ultra-fine particle size (5-25μm), high purity, suitable for precision pre-placement processes. Paste: Contains low-volatility organic carriers, uniform coating, suitable for welding complex structures. 4. Strong Wettability: Excellent wettability for alumina, aluminum nitride ceramics, and refractory metals.
Application:
Packing:
Precision grinding, intelligent manufacturing technology, integrated solutions
Aluminum foil bag, iron drum, plastic drum, woven bag, pallet, customized packaging
Date of delivery:
Precision grinding, intelligent manufacturing technology, integrated solutions
3-15 days
key word:
Product Name: AgCuTi
Chemical composition（wt%）
Powder Grade | Chemical Composition (wt%) | ||||
Ag | Cu | Ti | Melting Temperature Range (℃) | ||
AgCuTi | 68.7-70.7 | Bal. | 2.0-5.0 | Solidus | Liquidus |
770 | 810 | ||||
Solder Paste Grade | Composition (wt%) | ||||
Alloy Powder | Binder | Melting Temperature Range (℃) | |||
AgCuTi | 80-90 | Balance | Solidus | Liquidus | |
770 | 810 | ||||
Physical indicators
Solid-liquid line: 779℃
Brazing temperature: 779-899℃
Specification (mesh): -200mesh, -300mesh
Application areas
Brazing
Silver-based active brazing material has good wettability and is suitable for vacuum brazing connections of the following material combinations: diamond/carbon/graphite-metal, ceramic-ceramic, ceramic-metal, metal-metal brazing, etc.
Recommend products
1. Ultra-high purity: Silver content ≥99.95%, total impurities ≤500 ppm 2. Spherical morphology: sphericity >95%, good fluidity, suitable for screen printing, spraying and other processes 3. High conductivity/thermal conductivity: volume resistivity ≤1.6 μΩ·cm, thermal conductivity ≥420 W/(m·K) 4. Controllable particle size: standard particle size 0.1-20μm (customizable), low specific surface area, high sintering activity 5. Oxidation resistance: surface coated with anti-oxidation layer (optional), extending storage and processing stability
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1. High Electrical/Thermal Conductivity: 72% silver content, low solder joint resistivity, suitable for welding precision electronic contacts and conductive components. 2. Corrosion Resistance and Oxidation Resistance: Excellent stability of solder joints in humid and high-temperature environments, extending equipment life. 3. Flexible Forms: Powder: Uniform particle size (15-50μm), good fluidity, suitable for automated powder feeding processes. Paste: Contains environmentally friendly adhesives, convenient coating, strong adhesion. 4. Excellent Wettability: Fully wets base materials such as copper and stainless steel, resulting in dense, pore-free welds.
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1. Low-temperature brazing: Liquidus temperature of approximately 620℃, reducing the risk of damage to heat-sensitive components. 2. High electrical/thermal conductivity: Low solder joint resistivity, suitable for electronic components and conductive contact welding. 3. Morphological adaptability: Powder: Uniform particle size (20-75μm), good fluidity, suitable for automatic powder feeding or pre-placement processes; Paste: Contains environmentally friendly organic carriers, strong adhesion, convenient for manual coating. 4. Strong corrosion resistance: Excellent oxidation and sulfurization resistance of the solder joint, extending component life.
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