Other materials
3D Printing、MIM、HIP、Brazing、Spraying、Porous material、PM
BAg-7
Features:
1. Low-temperature brazing: Liquidus temperature of approximately 620℃, reducing the risk of damage to heat-sensitive components. 2. High electrical/thermal conductivity: Low solder joint resistivity, suitable for electronic components and conductive contact welding. 3. Morphological adaptability: Powder: Uniform particle size (20-75μm), good fluidity, suitable for automatic powder feeding or pre-placement processes; Paste: Contains environmentally friendly organic carriers, strong adhesion, convenient for manual coating. 4. Strong corrosion resistance: Excellent oxidation and sulfurization resistance of the solder joint, extending component life.
Application:
PM (powder metallurgy)
Packing:
Precision grinding, intelligent manufacturing technology, integrated solutions
Aluminum foil bag, iron drum, plastic drum, woven bag, pallet, customized packaging
Date of delivery:
Precision grinding, intelligent manufacturing technology, integrated solutions
3-15 days
key word:
Product Name: BAg56CuZnSn Silver Solder
【GradeCode】
- BAg56CuZnSn
- BAg-7（AWS）
- AG102（EN）
- Ag 156（ISO）
Chemical composition（wt%）
Powder Grade | Composition (wt%) | |||||
Ag | Cu | Zn | Sn | Melting Temperature Range (℃) | ||
BAg56CuZnSn | Solidus | Liquidus | ||||
55-57 | 21-23 | 15-19 | 4.5-5.5 | 620 | 655 | |
Solder Paste Grade | Composition (wt%) | ||||
Alloy Powder | Binder | Melting Temperature Range (℃) | |||
BAg56CuZnSn | Solidus | Liquidus | |||
80-90 | BalanceBal. | 620 | 655 | ||
Physical indicators
Powder Specification (mesh) -300 mesh, -100+200 mesh, other particle sizes can be customized
Application areas
Brazing Material
Jewelry
Excellent process performance, beautiful appearance
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Excellent process performance, moderate melting point, good wetting performance and gap filling performance, excellent strength, plasticity, conductivity, corrosion resistance and other properties
View Details
1. High Electrical/Thermal Conductivity: 72% silver content, low solder joint resistivity, suitable for welding precision electronic contacts and conductive components. 2. Corrosion Resistance and Oxidation Resistance: Excellent stability of solder joints in humid and high-temperature environments, extending equipment life. 3. Flexible Forms: Powder: Uniform particle size (15-50μm), good fluidity, suitable for automated powder feeding processes. Paste: Contains environmentally friendly adhesives, convenient coating, strong adhesion. 4. Excellent Wettability: Fully wets base materials such as copper and stainless steel, resulting in dense, pore-free welds.
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1. Active Brazing: Titanium element removes the oxide film, achieving a high-strength metallurgical bond between ceramic and metal. 2. High Heat Resistance: The braze joint can withstand temperatures above 600℃, and has excellent thermal shock resistance. 3. Morphological Adaptability: Powder: Ultra-fine particle size (5-25μm), high purity, suitable for precision pre-placement processes. Paste: Contains low-volatility organic carriers, uniform coating, suitable for welding complex structures. 4. Strong Wettability: Excellent wettability for alumina, aluminum nitride ceramics, and refractory metals.
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1. Ultra-high purity: Silver content ≥99.95%, total impurities ≤500 ppm 2. Spherical morphology: sphericity >95%, good fluidity, suitable for screen printing, spraying and other processes 3. High conductivity/thermal conductivity: volume resistivity ≤1.6 μΩ·cm, thermal conductivity ≥420 W/(m·K) 4. Controllable particle size: standard particle size 0.1-20μm (customizable), low specific surface area, high sintering activity 5. Oxidation resistance: surface coated with anti-oxidation layer (optional), extending storage and processing stability
View DetailsMaybe you want to know something else.
Contact Us
Address: No.39, Liandong Yougu lnd. Park, Bachelor Street,Changsha City,Hunan Province, China.
