Other materials

3D Printing、MIM、HIP、Brazing、Spraying、Porous material、PM

BCu55ZnMnNi

1. Excellent Process Performance: Moderate melting point (approximately 880~910℃), good fluidity, easy to fill weld seams. 2. Strong and Tough Bonding: High brazing joint strength, good resistance to vibration and fatigue. 3. Strong Corrosion Resistance: Good corrosion resistance to water, steam, and weakly acidic media. 4. Wide Adaptability: Compatible with various base materials and processes such as flame brazing and induction brazing.

CuP14

1. Self-fluxing function: Phosphorus generates phosphate during brazing, reducing oxidation and eliminating the need for additional flux. 2. Low melting point and easy operation: Solidus temperature is approximately 645℃, liquidus temperature is approximately 815℃, suitable for heat-sensitive workpieces. 3. High conductivity: The conductivity of the brazed joint is close to that of pure copper, ensuring reliable electrical connection. 4. Excellent wettability: It wets copper, brass and other base materials thoroughly, resulting in a dense, pore-free weld.

Electrolytic copper powder

Electrolysis can control the particle size of the powder so it can produce ultra -fine powder. It has high purity and larger surface area with good formability which powder shape is generally branched and suppressed

CuZn20

Excellent figurability and high strength, good weldability and machinability properties

CuSn3P7

It has high-strength and high toughness as well as good high temperature properties and corrosion resistance and good welding performance that can fill the small gap connector, we suggest the joint gap is 0.025-0.075mm

BCu92P

Similar with the eutectic composition of copper phosphorus, low welding temperature, The flowability of solder is very excellent, suitable for small junction of solder gaps, and formed very small solder angle after solder

CuMnNi

High strength, good wettability for substrate, properties of excellent welding performance, electrical conductivity, corrosion resistance and processability

Spherical Copper Powder

Gas atomization process, high density, high purity, good flowability, uniform particle distribution

CuSn20

Low melting point, good compactability, easy sintering; excellent strength、thermal conductivity、wear resistance 、color and lustre

CuSnTi

1. Active brazing: Titanium element removes the oxide film on the surface of ceramics/hard alloys, achieving high-strength heterogeneous material connection. 2. High thermal conductivity: The brazing seam has excellent thermal conductivity, suitable for heat sinks and high-temperature components. 3. Cost-effective: Copper-based alloys are low in cost, stable in performance, and have outstanding cost-effectiveness. 4. Flexible morphology: Powder: Fine particle size (10-50μm), good fluidity, suitable for automatic powder feeding process. Paste: Contains low-residue adhesive, convenient coating, strong adhesion. 5. Corrosion resistance: The brazing seam is oxidation-resistant and acid-alkali corrosion-resistant, extending the service life of components.

CuSnPNi

1. Self-fluxing function: Phosphorus effectively breaks down the oxide film, reduces the use of additional fluxes, and ensures clean brazing seams. 2. Low-temperature high efficiency: Liquidus temperature is approximately 640℃, reducing heat input and minimizing base material deformation. 3. Strong corrosion resistance: The brazing seam is oxidation-resistant and withstands humid environments, extending component service life. 4. Form adaptability: Powder: Uniform particle size (20-75μm), excellent flowability, suitable for automated powder feeding processes. Paste: Contains environmentally friendly bonding agents, easy to apply, and exhibits strong adhesion. 5. Economical and practical: Low cost of copper-based alloys, suitable for large-scale industrial production.

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316L、17-4PH、304L、MS1、FeSi6.5、FeCrAl、HK30、430