Nickel-based
Nickel-based filler material is a brazing filler composed of nickel as the matrix, supplemented with low-melting-point elements (such as boron, silicon, phosphorus, etc.) and strengthening elements (such as chromium, cobalt, molybdenum, tungsten, iron, etc.)
BCu100 copper brazing paste
Features:
Good fluidity, suitable for furnace brazing under a protective atmosphere.
Application:
Packing:
Aluminum foil bag, iron drum, plastic drum, woven bag, pallet, customized packaging
Date of delivery:
Precision grinding, intelligent manufacturing technology, integrated solutions
3-15 days
key word:
BCu-100 Pure Copper Solder Paste
High-Temperature Brazing · Electrical and Thermal Conductivity · Vacuum/Protective-Atmosphere Brazing
Process Advantages
Ultra-high purity ≥99.9%
Copper content ≥ 99.9%, with extremely low impurity levels, compliant with GB/T 5246 standards, ensuring clean and reliable weld joints.
Excellent electrical and thermal conductivity
Electrical conductivity ≥ 25% IACS (International Annealed Copper Standard), suitable for high‑performance applications such as electrical contacts and heat‑dissipation systems.
High-strength welding
The weld joint exhibits stable mechanical properties and high load-bearing capacity; in some cases, the strength of pure copper welds can approach that of the base metal itself.
Flexible granularity customization
Standard particle sizes (powders) and solder pastes are available, with customizable grading to meet diverse process requirements.
Product Real-World Photos & Microscopic Morphology
Actual photos of solder paste
BCu-100 pure copper solder paste: the paste is uniform, does not delaminate or form lumps, and has moderate viscosity with excellent flowability.
Brazed joint
Stainless steel/high-temperature alloy vacuum brazed joints exhibit full, rounded welds that are dense and free of defects.
Powder Microstructure
Vacuum atomized pure copper powder, available in irregular or near-spherical morphologies to meet diverse processing requirements.
About BCu-100 Pure Copper Solder Paste
BCu-100 (corresponding to the Chinese national standard BCu100A and AWS BCu-1) is a copper-based high‑temperature brazing paste, with high‑purity copper as its principal constituent and a copper content of ≥99.9%. This product is prepared by uniformly blending vacuum‑atomized high‑purity copper powder with an organic binder, exhibiting a high melting point (1083°C), excellent high‑temperature stability, and good fluidity. It is suitable for furnace brazing under protective atmospheres (hydrogen or argon) as well as for vacuum brazing applications.
Compared with conventional silver‑based or phosphor‑bronze brazing alloys, pure copper braze joints exhibit superior electrical conductivity, thermal conductivity, and corrosion resistance, making them suitable as a joining medium for materials such as copper and copper alloys, stainless steel, carbon steel, high‑temperature alloys, and nickel‑based alloys. During brazing, copper‑based fluxes—such as borax‑based fluxes—are typically employed to facilitate oxide removal and enhance the braze alloy’s wettability and fluidity. Following brazing, stress‑relief annealing at 250–350°C may be performed to eliminate welding‑induced thermal stresses, thereby ensuring dimensional stability and long‑term service reliability of the component.
Typical Chemical Composition (wt%)
| Element | Cu | Fe | Zn | Pb | Al | P | Sn | O |
|---|---|---|---|---|---|---|---|---|
| Standard value* | Margin | ≤0.02 | ≤0.02 | ≤0.01 | ≤0.01 | ≤0.05 | ≤0.02 | ≤0.1 |
| Typical measured values | ≥99.9 | 0.005 | 0.005 | <0.005 | <0.005 | 0.01 | <0.005 | 0.06 |
* Data are based on TIJO corporate standards and the typical values for the BCu100 alloy grade, in compliance with GB/T 5246. Oxygen content ≤ 0.1%, ensuring excellent oxidation resistance during brazing.
Physical Properties & Specification Parameters
| Parameter item | Technical indicators |
|---|---|
| Grade | BCu100 (BCu-1) |
| Melting point (solidus/liquidus) | 1083℃ / 1083℃ |
| Brazing temperature range | 1093-1149℃ |
| Powder morphology | Irregular shape/spherical (customizable) |
| Loose packing density | ≥3.0 g/cm³ |
| Screening particle size (mesh count) | 200 mesh / 300 mesh |
| Product form | Powder / Paste |
| Packaging Specifications | Aluminum foil bags, iron drums, plastic buckets, woven bags, pallets, custom packaging |
| Delivery time | 3–15 days |
*Supports granule size customization and paste viscosity adjustment, enabling personalized tailoring to meet customers’ brazing equipment and process parameters.
End-to-end testing capability
Each batch of product undergoes comprehensive inspection for composition, particle size, oxygen content, and flowability, ensuring that the solder paste meets the stringent quality requirements of vacuum brazing, induction brazing, and furnace brazing. A fully traceable Certificate of Analysis (COA) is provided for every batch.
Typical application scenarios
Power and Electrical Engineering
Conductive connection applications such as busbars, transformers, switch contacts, and high-temperature connectors in high-voltage transmission systems.
Refrigeration equipment
Air conditioner condenser, refrigerator evaporator, brazing of copper tubes and fittings for heat exchangers, refrigeration piping connections
Carbide tools
The carbide cutting head is joined to the steel body substrate by high-temperature brazing, resulting in high joint strength and excellent heat resistance.
Aerospace
Brazed joints for high-temperature engine components, hot-end assemblies of gas turbines, and aerospace structural parts.
Mechanical manufacturing
Welding of stainless steel–carbon steel composite structural components, copper and copper alloy structural components, and high‑temperature alloy assemblies.
Automotive industry
Automotive radiators, heat exchangers, high-voltage copper busbars for batteries, and electrical connection components for new-energy vehicles.
Electronic packaging
Integrated circuit lead frames, heat-sink substrates for power semiconductor modules, and vacuum electronic device packages
Dissimilar Material Welding
Reliable joining of dissimilar metallic materials such as copper–stainless steel, copper–nickel-based alloys, and copper–carbon steel.
Key Advantages of Choosing TIJO BCu-100 Pure Copper Solder Paste
- Background of Powder Metallurgy Technology at Central South University – The atomization technology originates from the Powder Metallurgy Research Institute, with sphericity and particle size distribution precisely controllable.
- Mass production, stable supply – Four dedicated production lines with a monthly capacity exceeding 200 tons, ensuring timely delivery.
- Strict quality control system – ISO 9001:2015 certified, with full batch traceability and a complete Certificate of Analysis (COA) provided.
- 48-hour free samples – Rapidly provide samples to validate brazing processes, reducing selection costs.
- Particle size customization/modification – Particle size and paste viscosity can be customized according to equipment parameters, with rapid response.
- End-to-end technical support – Collaborating with customers on development, from optimizing solder paste parameters to recommending brazing processes.
Chemical composition（wt%）
Solder paste grade | Chemical composition | |||||||
Cu | Fe | Zn | Pb | Al | P | Sn | O | |
BCu100 | Margin | ≤ 0.02 | ≤ 0.02 | ≤ 0.01 | ≤ 0.01 | ≤ 0.05 | ≤ 0.02 | ≤ 0.1 |
Physical indicators
Solder paste grade | Solid–liquid phase °C | Brazing temperature °C | Powder morphology | Loose packing density g/ centimeter ³ | Powder sieving ( eye ) | Other morphologies |
BCu100 | 1093-1149 | 1093-1149 | Irregular or spheroidal | ≥ 3.0 | 200/300 | powder / ointment |
Application areas
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