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Ag18CuP silver-copper-phosphorus brazing alloy · BAg18CuP
Brazing Flux · Low Melting Point · Available in Both Powder and Paste Forms -200 mesh, for brazing use only
Process Advantages
Self-fluxing agent function
At high temperatures, phosphorus reacts with copper oxide to form a phosphate slag that protects the weld seam, often eliminating the need for additional flux and significantly simplifying the process.
Low melting point · Wide brazing window
It has a moderate melting point and an optimal brazing temperature, making it well suited for the rapid brazing of copper and heat‑sensitive components while minimizing the risk of overheating the base material.
High electrical conductivity
The electrical conductivity of silver–copper–phosphorus alloy brazing seams is comparable to that of pure copper, ensuring reliable electrical connections and making it suitable for conductive and grounding components.
Excellent wettability
It provides excellent wetting on base materials such as copper, brass, and silver, producing welds that are dense and free of porosity, making it particularly well suited for brazing delicate workpieces.
Product Real-World Photos & Microscopic Morphology
SEM of Ag18CuP powder
Non‑vacuum atomized spherical powder with well‑rounded particles and a uniform particle size distribution.
Real-life photo of powdered brazing filler metal
Gray-black powder, packaged in a vacuum-sealed aluminum foil bag or a plastic can.
Actual photo of solder paste
Syringe/plastic can packaging, ready-to-use, with adjustable viscosity.
Ag18CuP silver-copper-phosphorus brazing alloy
Ag18CuP is a copper–phosphorus–silver brazing filler metal containing approximately 18% silver, corresponding to the GB BCu75AgP standard. It consists of a ternary alloy of copper, silver, and phosphorus. The addition of phosphorus imparts self‑reducing properties toward copper and copper alloys, so brazing of red copper typically does not require the use of an external flux. The inclusion of silver enhances wettability and improves the electrical and thermal conductivity of the brazed joint. Compared with the conventional silver‑free CuP14 filler metal, Ag18CuP retains its self‑fluxing characteristics while significantly improving wetting on brass, silver, and silver‑plated substrates, resulting in superior joint toughness and more balanced overall performance.
Both the solidus and liquidus temperatures of the product are 645°C (at the eutectic composition). The recommended brazing temperature range is 643–686°C. With a moderate melting point, it is well suited for rapid brazing of brass, red copper, silver alloys, and silver‑plated components, effectively minimizing base‑material oxidation and softening in the heat‑affected zone. The brazed joints exhibit excellent electrical conductivity, thermal conductivity, and corrosion resistance, making them suitable for long‑term service in applications such as electronic packaging, refrigeration piping, and power‑connection systems. At elevated temperatures, phosphorus reacts with cupric oxide to form phosphate slag, acting as a self‑fluxing agent; this makes the alloy particularly ideal for brazing red copper to red copper.
TIJO provides Powdered and Paste-like Dual‑form Ag18CuP brazing alloy. The powdered brazing filler metal is produced by non‑vacuum atomization, with a preferred particle size of –200 mesh (≤75 μm). It exhibits excellent sphericity and outstanding flowability, allowing for direct powder dispensing or pre‑placement on solder foils followed by pressing. The solder paste is ready‑to‑use, containing 80–90% alloy powder, with superior thixotropic properties, and is compatible with automated dispensing, screen printing, and manual application processes; viscosity can be customized to meet specific customer requirements. This product is widely used in electronic packaging, refrigeration equipment, power‑electrical devices, jewelry manufacturing, the automotive industry, and precision instrumentation, among other fields.
💡 Sample Description: Due to the relatively high price of silver-based brazing filler metals, this product does not offer free samples. We do provide small‑quantity powder and solder paste samples in 50 g, 100 g, 500 g, and other weights; please contact our sales team for sample pricing inquiries.
Chemical Composition (wt%, powder)
| Grade | Cu | Ag | P | Solidus (°C) | Liquidus temperature (°C) | Brazing temperature (°C) |
|---|---|---|---|---|---|---|
| BAg18CuP | Bal. | 17.0-19.0 | 6.6-7.5 | 645 | 645 | 643-686 |
* Powder specifications: -200 mesh (≤75 μm); particle size can be customized. Data are subject to the batch COA report; third-party testing is available.
Solder Paste Specifications
| Grade | Alloy powder content (wt%) | Binder (wt%) | Solidus (°C) | Liquidus temperature (°C) | Recommended Process |
|---|---|---|---|---|---|
| BAg18CuP solder paste | 80-90 | Margin | 645 | 645 | Automatic dispensing, screen printing, manual application |
* Solder paste viscosity can be customized to meet customer equipment and process requirements; store refrigerated, with a shelf life of 6 months.
Ag18CuP Brazing Process Reference
| Base material combination | Recommended Brazing Temperature (°C) | Flux Usage | Joint performance |
|---|---|---|---|
| Red copper–red copper | 650-680 | Usually no flux is required (self-fluxing). | The brazed joint is dense, with excellent bonding strength. |
| Red copper–brass | 660-690 | FB102 may be used in small quantities. | Good wetting, no porosity. |
| Brass - Brass | 670-700 | It is recommended to use FB102. | The brazed joint is bright and exhibits high strength. |
| Silver/Silver-Plated Parts | 650-680 | No flux or minimal flux required | Excellent wettability on silver, with no corrosion. |
* Copper brazing flux delivers excellent results; for brass brazing, it is recommended to use a small amount of FB102 borax‑based flux. Suitable for flame, induction, and furnace brazing.
Ag18CuP vs. conventional CuP14 brazing alloy
| Comparison item | Ag18CuP (silver-containing) | CuP14 (silver-free) |
|---|---|---|
| Wettability (on brass/silver) | ✓ Significantly superior to | General |
| Brazing seam toughness | ✓ Improved (silver enhances ductility) | Relatively brittle |
| Electrical conductivity | ✓ Higher (Silver Contribution) | Good |
| Applicable base material | Copper, copper alloys, silver, and silver-plated parts | Copper and copper alloys |
| Cost | Moderate (18% silver content) | Lower |
Ag18CuP, while retaining the self‑fluxing characteristics of the alloy, significantly enhances wettability on brass and silver‑plated substrates as well as joint ductility, making it ideal for high‑end electronic and refrigeration applications.
Powdered brazing filler metal
- Powder can be applied directly, or pre‑placed solder tabs can be used to press the material.
- Good flowability, suitable for automated powder conveying and flame brazing.
- It can be blended with other metal powders to formulate special compositions.
- Vacuum-packed, with a long shelf life.
Paste solder
- No on-site mixing of powder and adhesive is required; simply open the container and use.
- Excellent thixotropy, suitable for automated dispensing and screen printing.
- The carrier volatilizes completely, leaving minimal brazing residue.
- Viscosity is customizable to suit various process equipment.
Typical application areas
Electronic packaging
Chip leads, relay contacts, conductive connections on circuit boards, sensor terminals
Refrigeration industry
Air conditioner/refrigerator copper tubing, condenser, evaporator fittings, compressor components
Power equipment
Circuit breaker contacts, busbars, transformer windings, grounding terminals
Jewelry manufacturing
Precision welding of precious metal jewelry, silver chain joining, and brazing of inlays.
Automotive industry
Radiator, oil cooler, sensor housing, horn connector
Precision instruments
Brazing of instrument parts, conductor components, and contact springs
End-to-end testing capability
Each batch of Ag18CuP powder and solder paste is tested for chemical composition (silver and phosphorus content), particle size distribution, oxygen content, flowability, and tapped density. A Certificate of Analysis (COA) is provided.
Packaging & Delivery
Powder packaging
Vacuum-sealed in a double-layer aluminum foil pouch (to prevent oxidation), with an outer iron or plastic drum.
Specifications: 1 kg, 5 kg, 10 kg, 25 kg per drum
Solder paste packaging
Syringes (10 cc/30 cc/50 cc) or plastic containers (100 g/500 g/1 kg)
Store refrigerated; shelf life: 6 months.
Export packaging
Export orders are packed in wooden crates or pallets and reinforced to protect against moisture and impact.
Compatible with sea freight, air freight, and international express delivery.
Delivery time
Standard particle size in stock; ships within 3–5 days after order confirmation.
Solder paste customization or particle size fine-tuning: 7–15 days
Batch Traceability
For each batch, a sample is retained, and the COA report is shipped with the goods.
Supports third-party testing (e.g., SGS)
Small-gramage sample
Supports the purchase of 50 g, 100 g, and 500 g samples of powders and solder pastes.
Due to the high price of silver-based brazing filler metal, free samples are not available; trial samples must be purchased.
Customized Services
Particle size customization, solder paste viscosity adjustment
Meets special operating conditions and equipment requirements
Technical Support
Provides brazing process parameters and solder paste application guidelines.
Assist in resolving issues encountered during use.
Inquire Now for Free Samples
Fill out the form on the right or contact us directly; we will provide product samples, technical data sheets, and price quotes to help you quickly complete your additive manufacturing process validation.
Address: No.39, Liandong Yougu lnd. Park, Bachelor Street,Changsha City,Hunan Province, China.
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Address: No.39, Liandong Yougu lnd. Park, Bachelor Street,Changsha City,Hunan Province, China.
