Other materials
3D Printing、MIM、HIP、Brazing、Spraying、Porous material、PM
BCu92P copper-phosphorus brazing filler metal · Copper-based self-fluxing powder/paste
Low-melting-point, high-conductivity, silver-free soldering—specially formulated for environmentally friendly applications. -50 mesh / -100 mesh
Process Advantages
Self-brazing flux-free
At high temperatures, phosphorus reacts with copper oxide to form a phosphate slag; therefore, brazing of red copper typically does not require an additional flux, simplifying the welding process.
Low-temperature, high efficiency · Moderate melting zone
It has a moderate melting point and an optimal brazing temperature, minimizing thermal distortion in the base material’s heat-affected zone, making it well suited for the rapid brazing of copper and copper alloys.
High electrical conductivity
The weld seam exhibits electrical conductivity comparable to that of the base material, copper, with excellent electrical performance, making it suitable for conductive connections such as power busbars and high-frequency conductors.
Corrosion-resistant · Dense welds
The brazed joint is dense, resistant to humid and mildly acidic environments, and exhibits high long-term service reliability.
Product Real-World Photos & Microscopic Morphology
Powder SEM
Irregular/ nearly spherical particles, with uniform particle size and good flowability.
Real-life photo of powdered brazing filler metal
Gray powder, packaged in vacuum-sealed aluminum foil bags or plastic canisters.
Real-life photo of paste-type solder alloy
Syringe/plastic can packaging, ready-to-use, with adjustable viscosity.
BCu92P copper-phosphorus self-fluxing brazing filler metal
BCu92P (corresponding to ISO CuP 181a) is a high-phosphorus copper-based brazing filler metal, representing a grade with relatively high phosphorus content and a low melting point within the copper–phosphorus brazing alloy system. Its elevated phosphorus level imparts excellent self‑fluxing properties, enabling flux‑free brazing of red copper with welds that are dense and exhibit electrical conductivity comparable to pure copper. With a moderate brazing temperature, it is well suited for flame brazing, induction brazing, and resistance brazing. The powder is produced via non‑vacuum atomization combined with precision sieving, with primary particle sizes of −50 mesh (≤300 μm) and −100 mesh (≤150 μm), catering to diverse applications ranging from coarse‑powder soldering to fine‑powder pastes. The brazing paste is formulated by blending the powder with an organic binder (solid content 70–90%), offering ready‑to‑use performance and precise application. Free of silver, this product delivers outstanding cost efficiency, making it an ideal bulk consumable choice for brazing copper and copper alloys. It finds extensive use in air‑conditioning and refrigeration piping, power busbar connections, high‑frequency conductor sealing, and the brazing of copper hardware components.
Chemical Composition (wt%, Preferred Grade)
| Grade | Cu | P | Total impurities | Solidus (°C) | Liquidus temperature (°C) | Brazing temperature (°C) |
|---|---|---|---|---|---|---|
| BCu92P | Bal. | 7.5-8.1 | ≤0.20 | 710 | 770 | 720-843 |
* Complies with ISO CuP 181a, with tight control of oxygen content. Phosphorus content is precisely regulated to ensure brazing fluidity and self‑brazing performance.
Particle Size Specifications & Physical Properties (Powder Form)
| Particle size specification | Corresponding mesh count | D50 range (μm) | Loose packing density (g/cm³) | Tap density (g/cm³) | Flowability (s/50g) | Recommended Process |
|---|---|---|---|---|---|---|
| -50 mesh | ≤300μm | 120-180 | ≥3.5 | ≥4.5 | ≤28 | Flame brazing, powder spreading, and preformed foil pressing |
| -100 mesh | ≤150μm | 70-110 | ≥3.6 | ≥4.6 | ≤26 | Paste raw materials, induction brazing, automatic powder feeding |
| -200 mesh | ≤75μm | 45-65 | ≥3.8 | ≥4.8 | ≤25 | Fine paste and fine powder brazing |
* -50 mesh and -100 mesh are our standard recommended specifications; other particle sizes are available upon request.
Solder Paste Specification (BCu92P)
| Grade | Alloy powder content (wt%) | Binder (wt%) | Solidus (°C) | Liquidus temperature (°C) | Recommended Process |
|---|---|---|---|---|---|
| BCu92P solder paste | 70-90 | Margin | 710 | 770 | Automatic dispensing, screen printing, manual coating |
* Viscosity can be customized to suit the customer’s dispensing equipment; the carrier evaporates completely, leaving minimal residue.
BCu92P Brazing Process Reference
| Base material combination | Recommended Brazing Temperature (°C) | Flux Usage | Joint characteristics |
|---|---|---|---|
| Red copper–red copper | 730-780 | Usually no flux is required (self-fluxing). | The brazed joint is dense and exhibits high electrical conductivity. |
| Red copper–brass | 750-810 | FB102 may be used in small quantities. | Good wetting, with a full brazing angle. |
| Brass - Brass | 770-830 | It is recommended to use FB102. | The brazed joint is bright and exhibits high strength. |
| Copper-steel | 780-840 | FB102/borax is required. | Good compatibility; suitable for non-pressure-bearing components. |
* Pure copper exhibits the best self‑brazing performance; for brass, it is recommended to use a small amount of flux. Induction brazing is best performed at higher temperatures, while flame brazing should be carried out using a neutral flame.
BCu92P vs Other Copper-Phosphorus Brazing Alloys
| Grade | Phosphorus content (%) | Liquidus temperature (°C) | Self-brazing | Resilience | Typical Applications |
|---|---|---|---|---|---|
| BCu92P | 7.5-8.1 | 770 | Excellent | Relatively brittle | The first choice for brazing red copper |
| BCuP-2 | 6.5-7.0 | 800 | Good | Medium | General-purpose copper brazing |
| BCuP-5 | 5.8-6.2 | 870 | General | Better | Brazing of Large Workpieces |
BCu92P is a copper–phosphorus alloy with a high phosphorus content and a low melting point, offering excellent self‑brazing performance and making it the material of choice for brazing red‑copper pipe fittings.
Powdered brazing filler metal (-50 mesh / -100 mesh)
- Can be directly sprinkled as powder or pressed into preformed solder tabs.
- Good fluidity, suitable for automated powder feeding and flame brazing.
- It can be blended with other metal powders to formulate special compositions.
- Vacuum-sealed for long-term storage without oxidation.
Paste-type brazing filler metal (ready-to-use)
- No on-site mixing of powder and adhesive is required; simply open the container and use.
- Excellent thixotropy, precise dispensing/printing, and no sagging.
- The carrier volatilizes completely, leaving minimal residue.
- Viscosity is adjustable, making it compatible with various dispensing equipment and manual coating applications.
Typical application areas
Refrigeration equipment
Air conditioner/refrigerator condenser, evaporator piping, compressor copper fittings
Power industry
Busbar connections, cable joints, transformer windings, grounding terminals
Electronic components
High-frequency conductors, vacuum device sealing, RF connectors
Hardware processing
Copper fittings, valves, radiators, plumbing and bathroom fixtures
Automotive industry
Radiator, oil cooler, air-conditioning piping, sensor housing
General Industry
Copper heat exchangers, conductive components, and pipe brazing
End-to-end testing capability
For each batch of BCu92P powder, chemical composition (Cu, P), particle size distribution, oxygen content, flowability, and tapped density are analyzed, and a Certificate of Analysis (COA) is provided.
Packaging & Delivery
Powder packaging
Vacuum-sealed in a double-layer aluminum foil pouch (to prevent oxidation), with an outer iron or plastic drum.
Specifications: 1 kg, 5 kg, 10 kg, 25 kg, 50 kg per drum
Solder paste packaging
Syringes (10 cc/30 cc/50 cc) or plastic containers (100 g/500 g/1 kg)
Store refrigerated; shelf life: 6 months.
Export packaging
Export orders are packed in wooden crates or palletized and reinforced to protect against moisture and impact.
Compatible with sea, air, and international express shipping.
Delivery time
Standard particle sizes are in stock; shipment will be arranged within 2–5 days after order confirmation.
Solder paste customization or particle size fine-tuning: 3–7 days
Batch Traceability
For each batch, a sample is retained, and the COA report is shipped with the goods.
Supports third-party testing (e.g., SGS)
Free sample
Free samples are provided for process validation.
Small-batch samples; bulk supply upon quality confirmation.
Customized Services
Particle size customization, solder paste viscosity adjustment
Meets special operating conditions and equipment requirements
Technical Support
Providing brazing process parameters and solder paste application guidelines.
Assist in resolving issues encountered during use.
Inquire Now for Free Samples
Fill out the form on the right or contact us directly; we will provide product samples, technical data sheets, and price quotes to help you quickly complete your additive manufacturing process validation.
Address: No.39, Liandong Yougu lnd. Park, Bachelor Street,Changsha City,Hunan Province, China.
Recommend products
Maybe you want to know something else.
Contact Us
Address: No.39, Liandong Yougu lnd. Park, Bachelor Street,Changsha City,Hunan Province, China.
