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Spherical tin powder · High-purity spherical tin powder · Sn
High sphericity · Low oxygen content · Specifically for electron beam welding/3D printing 25-45μm / 45-80μm
Process Advantages
Spherical particles · High flowability
Excellent sphericity, smooth particle surfaces, outstanding flowability, and superior printing and filling performance; compatible with precision solder paste and 3D printing processes.
High purity · Low oxygen content
High tin content, well‑controlled oxygen levels, and stringent control of critical impurities ensure welding reliability and batch-to-batch consistency.
Controllable particle size · Highly adaptable
Standard particle sizes of 25–45 μm and 45–80 μm are available, with support for a wide range of customizations to meet the requirements of various processes, including solder paste application, spray coating, and laser cladding.
Low oxidizing power · Long-term stability
Encapsulated in an inert gas, it exhibits excellent oxidation resistance, remaining stable against oxidation during long-term storage and ensuring consistent welding and machining performance.
Product Real-World Photos & Microscopic Morphology
Powder SEM
High sphericity, smooth particle surface, and narrow particle size distribution.
Real-life photos of the powder
Gray powder, packaged in vacuum-sealed aluminum foil bags or plastic bottles, with batch traceability.
SMT solder paste/3D printing
Precision electronic welding, 3D-printed electronic circuits, conductive coatings
Spherical tin powder: high-purity, electronic-grade tin powder
Tin is one of the most fundamental metallic materials in the fields of electronic assembly and additive manufacturing. Spherical tin powder is produced via a non‑vacuum gas atomization process: high‑purity tin ingots are melted and atomized under an inert gas atmosphere, then subjected to precise sieving to yield a premium powder with excellent sphericity and a narrow particle size distribution. The product boasts a high tin content, tightly controlled oxygen levels, and extremely low concentrations of critical impurities such as Pb, Bi, Sb, Cu, Zn, Al, As, Cd, and Fe. It exhibits outstanding flowability and maintains stable thixotropy when blended with solder pastes, making it ideal for high‑reliability electronic packaging applications—including SMT solder paste, BGA/CSP chip bonding, and microelectronic interconnects. Moreover, its exceptional sphericity ensures superior performance in 3D‑printed electronic circuits, conductive coatings, electromagnetic shielding materials, and the fabrication of metal‑matrix composites. Standard particle sizes range from 25–45 μm (Type 4/5 solder paste powder) to 45–80 μm (coarse powder/spraying), with extensive customization options available to meet diverse process requirements.
Chemical Composition (wt%, FYD Standard)
| element | Content | element | Content (ppm ≤) |
|---|---|---|---|
| Sn | ≥99.9% | Pb | 500 |
| O | ≤0.1% | Bi | 500 |
| Total impurities | ≤0.1% | Sb | 500 |
| —— Impurity Elements —— | Cu | 500 | |
| Zn | 10 | Ag | 500 |
| Al | 10 | As | 300 |
| At | 500 | Cadmium | 20 |
| Fe | 200 | Ge | 500 |
| Ni | 100 | In | 500 |
Key Particle Size Specifications & Physical Properties
| Particle size specification | Corresponding mesh count (for reference) | D10 (μm) | D50 (μm) | D90 (μm) | Loose packing density (g/cm³) | Sphericity | Recommended Process |
|---|---|---|---|---|---|---|---|
| ★ 25–45 μm | -325+500 mesh | ≥20 | 32-38 | ≤48 | ≥4.0 | ≥95% | SMT solder paste, BGA/CSP soldering, microelectronic interconnection |
| ★ 45-80μm | -200+325 mesh | ≥35 | 55-65 | ≤85 | ≥4.2 | ≥95% | Conductive coatings, 3D printing, catalyst supports, thermal spraying |
| 5–25 μm | -500+800 mesh | ≥4 | 12-18 | ≤28 | ≥3.6 | ≥93% | Ultra-fine solder paste, precision printing, MIM injection molding |
* Standard inventory is primarily available in 25–45 μm and 45–80 μm particle sizes; other particle sizes within this range can be customized upon request.
| Parameter item | Numerical value | Note |
|---|---|---|
| CAS Registry Number | 7440-31-5 | — |
| Density (theoretical) | 7.28 g/cm³ | — |
| Melting point | 231.89℃ | Solid–liquid line: 232°C |
| Boiling point | 2260℃ | — |
| Electrical conductivity (annealed state) | ≈8.7 MS/m | Excellent electrical conductivity |
Typical application areas
Electronic packaging
SMT solder paste, BGA/CSP chip soldering, microelectronic interconnection, precision solder paste
Additive manufacturing
3D printing of electronic circuits, forming of metal composite materials, conductive structural components
Surface Engineering
Conductive coating, electromagnetic shielding layer, metal repair spray coating
Chemical catalysis
Catalyst support, alloy additive, organotin synthesis
Powder metallurgy
Oil-impregnated bearings, friction materials, metal injection molding
Electronic conductivity
Conductive adhesives, conductive inks, antistatic coatings
Spherical Tin Powder vs. Irregular Tin Powder
| Performance Dimension | Spherical tin powder (TIJO) | Irregular tin powder |
|---|---|---|
| Liquidity | ✓ Excellent | Poor; prone to clogging. |
| Loose packing density | ✓ High | Low |
| Solder paste printability | ✓ Uniform, no clogging of the mesh | Poor, easy to draw into wires |
| 3D printing compatibility | ✓ Even powder distribution, resulting in a dense, well‑formed product. | Unable to use |
| Oxygen content | Well controlled | Relatively high, easily oxidized |
Spherical tin powder is the preferred choice for high-end electronic soldering and additive manufacturing processes, significantly enhancing solder paste printing quality and the density of printed parts.
Process Recommendations and Parameters
| Craftsmanship | Recommended particle size | Key parameters | Product Performance |
|---|---|---|---|
| SMT solder paste | 25–45 μm | Mixed with ROL0/RMA flux, solid content 88–90% | Excellent printability, with bright solder joints. |
| 3D printing (SLM/DIW) | 25-45μm / 45-80μm | Laser power: 100–300 W; layer thickness: 30–80 μm. | Density ≥ 98%, excellent electrical conductivity |
| Conductive coating spraying | 45–80 μm | Plasma/Flame Spraying, Coating Thickness 50–200 μm | The coating is dense, with low resistivity. |
End-to-end testing capability
Each batch of spherical tin powder is tested for tin content, impurity elements, particle size distribution, oxygen content, sphericity, flowability, and bulk/ tapped density. COA reports and RoHS test reports are provided.
Packaging & Delivery
Powder packaging
Vacuum-sealed in a double-layer aluminum foil pouch (to prevent oxidation), with an outer iron or plastic drum.
Specifications: 1 kg, 5 kg, 10 kg, 25 kg, 50 kg per drum
Export packaging
Export orders are packed in wooden crates or palletized and reinforced to protect against moisture and impact.
Compatible with sea, air, and international express shipping.
Delivery time
Standard particle size in stock; ships within 2–5 days after order confirmation.
Custom particle size or higher purity: 5–15 days
Batch Traceability
For each batch, a sample is retained, and the COA report is shipped with the goods.
Supports third-party testing (e.g., SGS)
Free sample
Free samples are provided for process validation.
Small-batch samples; bulk supply upon quality confirmation.
Customized Services
Custom particle size, higher purity, and lower oxygen content
Meets special operating conditions and equipment requirements
Shipping documents
COA, MSDS, ingredient list, packing list
Meets export customs clearance requirements and customer in-plant inspection standards.
Technical Support
Providing solder paste formulation recommendations and process parameter guidance.
Assist in resolving issues encountered during use.
Inquire Now for Free Samples
Fill out the form on the right or contact us directly; we will provide product samples, technical data sheets, and price quotes to help you quickly complete your additive manufacturing process validation.
Address: No.39, Liandong Yougu lnd. Park, Bachelor Street,Changsha City,Hunan Province, China.
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Address: No.39, Liandong Yougu lnd. Park, Bachelor Street,Changsha City,Hunan Province, China.
