Other materials
3D Printing、MIM、HIP、Brazing、Spraying、Porous material、PM
Spherical copper powder · High-purity atomized copper powder
Sphericity · High electrical conductivity · Specifically for powder metallurgy, 3D printing, and electronic materials -100 mesh ~ -400 mesh / 15–53 μm
Process Advantages
High electrical and thermal conductivity
It exhibits high electrical conductivity and excellent thermal conductivity, second only to silver, making it an ideal choice for electronic materials and thermal management applications.
High sphericity · Excellent flowability
Good sphericity, smooth surface, low Hall flow rate, and high tapped density, making it well-suited for automated powder feeding and precision forming.
High purity · Low oxygen content
High purity, with well‑controlled oxygen content and stringent impurity levels, ensuring sintering quality and electrical conductivity stability.
Particle size is flexibly adjustable.
Standard mesh sizes range from 100 to 400 mesh; custom micron‑level specifications such as 15–53 μm and 0–25 μm are also available, catering to a wide variety of process requirements.
Product Real-World Photos & Microscopic Morphology
SEM of spherical copper powder
High sphericity, uniform particle size, and smooth surface.
Real-life photos of the powder
Light rose-red powder, packaged in vacuum-sealed aluminum foil bags or iron drums.
3D printing/conductive paste
SLM-printed parts, internal electrodes of MLCCs, oil-impregnated bearings
Atomized spherical copper powder
Spherical copper powder is produced from high-purity electrolytic copper using an inert‑gas atomization process. It exhibits excellent sphericity, superior flowability, high tapped density, low oxygen content, and a uniform particle size distribution, meeting the stringent quality requirements of powder metallurgy, electronic materials, additive manufacturing, brazing alloys, conductive composites, and other applications. As a pure metal, copper boasts electrical and thermal conductivity second only to silver; powder‑based products deliver high electrical conductivity and outstanding thermal conductivity. The product line offers two grades—Cu‑1 and Cu‑2—with particle sizes ranging from 100 mesh to 400 mesh, and custom specifications are available in micron‑scale ranges such as 15–53 μm and 0–25 μm. These powders are compatible with a wide array of advanced processes, including SLM, EBM, powder metallurgy (PM), metal injection molding (MIM), hot isostatic pressing (HIP), cold spraying, and laser cladding.
Grade and Chemical Composition (wt%)
| Grade | Cu+Ag ≥ | O ≤ | Total of other impurities ≤ |
|---|---|---|---|
| Cu-1 | 99.8% | 0.08% | 0.20% |
| Cu-2 | 99.7% | 0.08% | 0.30% |
* Cu-1 is suitable for applications in the electronics and additive manufacturing sectors that demand exceptionally high electrical and thermal conductivity; Cu-2 is intended for conventional industrial uses such as powder metallurgy and brazing. The exact composition shall be determined by the batch‑specific test report.
Physical Properties and Particle Size Specifications
Physical properties
| Parameter | Typical value |
|---|---|
| Density | 8.92 g/cm³ |
| Melting point | 1083±5℃ |
| Boiling point | 2595℃ |
| Loose packing density | 3.5–4.5 g/cm³ |
| Liquidity | ≤30 s/50g |
| Electrical conductivity (product) | ≥98% IACS |
| Thermal conductivity (of the product) | ≈401 W/(m·K) |
Standard particle size specifications
| Specifications | Particle size range | Typical particle size distribution |
|---|---|---|
| -100 mesh | <150μm | >150 μm ≤ 1%, <45 μm ≥ 60% |
| -200 mesh | <75μm | >75 μm ≤ 1%, <45 μm ≥ 70% |
| -300 mesh | <45μm | >45 μm ≤ 3%, <45 μm ≥ 97% |
| -400 mesh | <38μm | >38 μm ≤ 3%, <38 μm ≥ 97% |
* Customizable micron‑level specifications, including 15–53 μm, 0–25 μm, 45–105 μm, and 75–150 μm.
Particle Size and Process Selection Guide
| Particle size specification | Recommended Process | Typical Applications |
|---|---|---|
| -100 mesh (<150 μm) | Powder metallurgy pressing, thermal spraying | Oil-impregnated bearings, gears, and friction material additives |
| -200 mesh (<75 μm) | Powder metallurgy, brazing, thermal spraying | Copper-based brazing alloys, mechanical components, conductive composite materials |
| -300 mesh (<45 μm) | MIM, fine powder metallurgy, brazing paste | Precision parts, solder paste raw materials, conductive pastes |
| -400 mesh (<38 μm) | MIM, conductive pastes, precision brazing | High-precision micro-components, electronic pastes, and MLCC internal electrodes |
| 15–53 μm | SLM, EBM, cold spraying | 3D-printed metal parts, heat exchangers, and electronic components |
| 0-25μm | Fine MIM, conductive ink | Ultrafine powder technology, conductive ink, catalyst |
* The above is the standard recommendation; the specific particle size can be customized according to customer requirements.
Typical application areas
Powder Metallurgy (PM)
Oil-impregnated bearings, gears, mechanical components, and copper-based alloy parts
Electronic materials
Conductive pastes, conductive adhesives, conductive inks, MLCC internal electrodes, electromagnetic shielding
Additive Manufacturing/3D Printing
SLM/EBM printing of electrical components, heat exchangers, and heating elements
Brazing/Welding
Copper-based brazing filler powder (in paste or powder form)
Thermal management
High‑thermal‑conductivity composite materials, thermal‑dissipation coatings, and heat dissipation for electronic components
Friction material
Brake pad and clutch disc additives
Chemical catalysis
Catalyst, adsorbent, preservative
Aerospace
Aerospace functional and structural components
Atomized spherical copper powder vs. electrolytic copper powder
| Performance Dimension | Atomized spherical copper powder | Electrolytic copper powder |
|---|---|---|
| Appearance | Spherical/ nearly spherical | Branch-like |
| Liquidity | Excellent (≤30s/50g) | General |
| Loose packing density | High (3.5–4.5 g/cm³) | Lower |
| Green compact strength | Medium | High (mechanical interlock) |
| Sintering activity | Good | High |
| Typical Applications | 3D printing, conductive pastes, thermal spraying | Powder metallurgy, oil-impregnated bearings, diamond tools |
Atomized spherical copper powder exhibits significant advantages in flowability, tapped density, and additive manufacturing compatibility, making it well suited for high-end electronics and 3D printing applications.
Process Recommendations and Parameters
| Craftsmanship | Recommended particle size | Key parameters |
|---|---|---|
| SLM 3D printing | 15–53 μm | Laser power: 150–300 W; layer thickness: 30–50 μm. |
| Powder metallurgy pressing + sintering | -200 mesh / -300 mesh | Press at 400–700 MPa, sinter at 850–950°C (in a reducing atmosphere) |
| MIM injection molding | -300 mesh / -400 mesh | Catalytic degreasing + sintering at 850–950°C |
| Conductive paste | -400 mesh / 0–25 μm | Mixed with an organic carrier, three-roll milling. |
* Copper powder is prone to oxidation; sintering or printing is recommended under a reducing atmosphere or in a vacuum, and the container should be sealed promptly after opening.
End-to-end testing capability
Each batch of spherical copper powder is tested for major elements (Cu), impurities (Fe, Pb, Zn, etc.), oxygen content, particle size distribution, flowability, and tapped/loose bulk density. A Certificate of Analysis (COA) is provided.
Packaging & Delivery
Powder packaging
Vacuum-sealed in a double-layer aluminum foil pouch (to prevent oxidation), with an outer iron or plastic drum.
Specifications: 1 kg, 5 kg, 10 kg, 25 kg, 50 kg per drum
Export packaging
Export orders are packed in wooden crates or palletized and reinforced to protect against moisture and impact.
Compatible with sea freight, air freight, and international express delivery.
Delivery time
Standard particle sizes are in stock; shipment will be arranged within 2–5 days after order confirmation.
Custom particle size or minor formulation adjustments: 7–12 days
Batch Traceability
For each batch, a sample is retained, and the COA report is shipped with the goods.
Supports third-party testing (e.g., SGS)
Free sample
Free samples are provided for process validation.
Small-batch samples; bulk supply upon quality confirmation.
Customized Services
Custom particle size, fine-tuned formulation
Meets special operating conditions and equipment requirements
Shipping documents
COA, MSDS, ingredient list, packing list
Meets export customs clearance requirements and customer in-plant inspection standards.
Technical Support
Provide process parameter guidance for PM, MIM, and SLM.
Assist in resolving issues encountered during use.
Inquire Now for Free Samples
Fill out the form on the right or contact us directly; we will provide product samples, technical data sheets, and price quotes to help you quickly complete your additive manufacturing process validation.
Address: No.39, Liandong Yougu lnd. Park, Bachelor Street,Changsha City,Hunan Province, China.
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Address: No.39, Liandong Yougu lnd. Park, Bachelor Street,Changsha City,Hunan Province, China.
