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AgCuInTi silver-copper-indium-titanium active brazing alloy
Available in three forms: powder, paste, and foil. Low-Temperature Active Brazing · Ceramic/Metal Joining · Specialized for Diamond Tools

AgCuInTi is a silver-based active brazing alloy that enhances the overall performance of conventional silver–copper brazing alloys by incorporating indium (In) and titanium (Ti). Titanium imparts active properties, enabling direct brazing of non-metallic materials such as ceramics (Al₂O₃, AlN, Si₃N₄), graphite, and diamond without prior metallization. Indium significantly improves fluidity and wettability while lowering the melting point. The powder is produced via atomization in a non‑vacuum environment, exhibiting excellent sphericity and outstanding flowability. The product is available in three forms—-200 mesh/-300 mesh powders, ready‑to‑use pastes, and foil sheets—suitable for vacuum brazing, protective‑atmosphere brazing, and other processes. It finds extensive applications in aerospace, ceramic–metal packaging, diamond tools, electronic devices, and the joining of dissimilar metals. The core technical team originates from the Powder Metallurgy Research Institute of Central South University.
Explanation of Small-Weight Test Specimens: Due to the high price of silver-based brazing filler metal, this product does not offer free samples. Support is available. 50g, 100g, 500g We offer small‑gram‑weight powder and solder paste samples for purchase, and foil sheets can be cut to size upon request. Please contact our sales team to obtain sample pricing.

Process Advantages

Low-temperature active brazing

The brazing temperature is moderate, lower than that of AgCuTi4.5, thereby minimizing the thermal impact on the base material; it meets the requirements for stepwise brazing and repair brazing.

The active role of titanium

The Ti element breaks down the oxide film on the base material’s surface and exhibits excellent wettability toward ceramics, graphite, and diamond, eliminating the need for prior metallization.

Indium element–enhanced performance

In elements significantly enhance fluidity and wettability, strengthen the Ag matrix through solid-solution strengthening, and lower the melting point without compromising joint strength.

Flexible configuration across three forms

Available in powder, paste, and foil forms, it is compatible with a variety of soldering methods, including vacuum brazing, dispensing, screen printing, and pre‑placed solder.

Product Real-World Photos & Microscopic Morphology

Powder SEM (-300 mesh)

Spherical or near-spherical particles with uniform particle size and excellent flowability.

Real-life photos of powder/cream products

Light coffee-colored powder, packaged in vacuum-sealed aluminum foil bags; paste-like formulation in a syringe.

Ceramic/Metal Brazed Components

Al₂O₃–oxygen-free copper brazed joint, diamond tools

AgCuInTi silver-copper-indium-titanium active brazing alloy

AgCuInTi is a silver-based active brazing alloy, classified as a low-temperature active brazing material. By incorporating indium (In) and titanium (Ti), its overall performance has been optimized compared to conventional silver–copper brazing alloys. The addition of titanium enables the alloy to form chemical metallurgical bonds with non-metallic materials such as ceramics (alumina Al₂O₃, aluminum nitride AlN, silicon nitride Si₃N₄), graphite, and diamond, eliminating the need for prior metallization of the ceramic substrates, thereby significantly simplifying the process and reducing costs. Indium markedly enhances the alloy’s fluidity and wettability while lowering its melting point without compromising mechanical strength, making it particularly well suited for stepwise brazing, repair brazing, and the joining of thermally sensitive components.

The product is available in three forms—powder (-200 mesh, -300 mesh), ready-to-use paste (containing an organic binder), and foil—suitable for a variety of processes, including vacuum brazing, protective-atmosphere brazing, dispensing, screen printing, and pre‑placed brazing filler. The powder form exhibits excellent sphericity and outstanding flowability, making it particularly well suited for automated powder feeding and the pressing of pre‑formed brazing foils; the paste form offers superior thixotropy, ideal for dispensing, screen printing, and joining components with complex geometries; and the foil form features uniform thickness (0.05–0.1 mm), making it ideal for large‑area face‑to‑face joints and high‑volume production.

TIJO employs a non‑vacuum gas atomization process to produce spherical AgCuInTi powder, with products compliant with GB/T 10046 “Silver Brazing Alloys” and JB/T 7520 “Silver–Copper–Titanium Brazing Alloys.” A Certificate of Analysis (COA) is provided for each batch. The material is suitable for vacuum brazing (at pressures ≥1.0×10⁻² Pa) and brazing under a high‑purity argon atmosphere, with brazing temperatures ranging from 650 to 800°C and holding times of 10 to 30 minutes. Prior to brazing, the base metal surfaces must be thoroughly cleaned; for ceramic–metal brazing, no pre‑metallization of the ceramic is required. This product finds extensive applications in aerospace, ceramic–metal packaging, diamond tools, electronics and electrical engineering, and the joining of dissimilar metals.

💡 Sample Description: Due to the relatively high price of silver-based brazing filler metal, this product does not offer free samples. We do provide sample quantities in small weights such as 50 g, 100 g, and 500 g, including powder and solder paste. Foil samples can be cut to size upon request. Please contact our sales team for sample pricing inquiries.

Chemical Composition (wt%)

Powders & Solder Pastes

element Content range
Ag 42.6-44.6
Cu Margin (Bal.)
In 23.3-25.3
Ti 2.0-4.0
O ≤ 0.05

* Solder paste contains 80–90% alloy powder, with the remainder being binder.

Foil sheet

element Content range
Ag 58.2-60.2
Cu 22.0-24.0
In 13.0-15.0
Ti 2.0-5.0

* The foil and powder compositions are slightly different to accommodate various brazing processes.

Physical Properties & Brazing Temperature

Product form Solidus (°C) Liquidus temperature (°C) Recommended Brazing Temperature (°C) Recommended vacuum level
Powder / Solder Paste 540 650 650-800 ≥1.0×10⁻² Pa
Foil sheet 610 710 740-780 ≥1.0×10⁻² Pa

* Powder and solder paste: solid–liquid phase temperature 540–650°C; foil: 610–710°C. Powder tapped density ≥3.5 g/cm³; oxygen content ≤500 ppm.

Particle Size Specifications & Morphology Selection Guide

Specification/Format Granularity/Features Recommended Process Typical Applications
-200 mesh ≤74μm Vacuum brazing, powder pre‑placement General-purpose powder specification, suitable for most brazing applications.
-300 mesh ≤48μm Precision brazing, paste formulation Fine-gap joints, brazing of precision components, solder paste raw materials
Paste-like 80–90% alloy powder + binder Dispensing, screen printing, manual coating Complex-shaped workpieces, automated welding, mass production
Foil sheet 0.05-0.1mm Vacuum brazing, furnace brazing Pre‑placed solder, face‑to‑face bonding, mass production

* We primarily offer powders in 200-mesh and 300-mesh grades; pastes and foil sheets can be customized to meet customer requirements for size and viscosity.

Brazing Process Reference

Brazing method Recommended vacuum level Brazing temperature (°C) Holding time Applicable form
Vacuum brazing ≥1.0×10⁻² Pa 650-800 10-30 min Powder/Paste/Foil
Protective-atmosphere brazing High-purity argon gas 650-800 10-30 min Powder/Paste

* Prior to brazing, the base metal surfaces must be thoroughly cleaned to remove oil and oxide scale. In ceramic–metal brazing, pre‑metallization of the ceramic is not required.

Typical application areas

Aerospace

Engine components, heat exchangers, high-temperature structural parts, high-strength and high-temperature resistant

Ceramic-Metal Bonding

Al₂O₃/Cu, AlN/Kovar: Ti breaks the oxide film, eliminating the need for prior metallization.

Diamond tools

PDC/PCD/diamond brazed to metal, with excellent wettability and strong bonding strength.

Electronics and Electrical Engineering

Semiconductor packaging, vacuum device sealing, electron vacuum devices

Refrigeration industry

Compressor and condenser piping connections, with low-temperature brazing to minimize thermal impact.

Cemented carbide

Vacuum brazing of YG16 to carbon steel yields joints with high strength and excellent interfacial bonding.

Dissimilar metal joining

Welding of ferrous and non-ferrous metals exhibits good fluidity and wettability.

Energy equipment

Solar thermal collector panels, nuclear energy components—high-temperature resistant and thermally shock‑resistant.

AgCuInTi vs. related active brazing alloys

Comparison item AgCuInTi (this product) AgCuTi4.5
Active element Ti 2.0-4.0% Ti 4.5%
Melting-point-lowering element In 23.3-25.3% None
Solidus (°C) 540 ≈780
Brazing temperature (°C) 650-800 900-960
Liquidity Excellent (In Improvement) Good
Applicable Scenarios Low-temperature active brazing, stepwise brazing High-Temperature Active Brazing

AgCuInTi exhibits a lower operating temperature than AgCuTi4.5, meeting the requirements for staged brazing and repair welding. The In element strengthens the Ag matrix through solid-solution strengthening, thereby enhancing joint strength.

Process Tips and Component Selection

Form Applicable Scenarios Key Tips
powder Pre-set powder, automatic powder feeding Vacuum/protective-atmosphere brazing with excellent fluidity.
Paste-like Dispensing, printing, manual coating Ready to use out of the box, with precise control over the amount of solder.
Foil sheet Pre‑placed solder and large‑area bonding Uniform thickness, suitable for mass production.

* During ceramic–metal brazing, titanium atoms enrich at the ceramic interface, forming a reaction layer that facilitates chemical metallurgical bonding.

End-to-end testing capability

Laser Particle Size Analyzer Oxygen, Nitrogen, and Hydrogen Analyzer Scanning Electron Microscopy (SEM+EDS) Carbon-sulfur analyzer Hall flowmeter/vibrating density meter ICP-OES Elemental Analysis

Each batch of AgCuInTi powder and solder paste is tested for major elements (Ag, Cu, In, Ti), oxygen content, particle size distribution, flowability, and loose/compacted density. Additionally, brazed joints are periodically fabricated to evaluate shear strength and microstructure. COA reports are provided.

Packaging & Delivery

 

Powder packaging

Vacuum-sealed in a double-layer aluminum foil pouch (to prevent oxidation), with an outer iron or plastic drum.
Specifications: 1 kg, 5 kg, 10 kg, 25 kg, 50 kg per drum

 

Solder paste/foil packaging

Solder paste: syringes (10 cc/30 cc/50 cc) or plastic jars
Foil: in roll or sheet form, cut to customer specifications.

 

Export packaging

Export orders are packed in wooden crates or pallets and reinforced to protect against moisture and impact.
Compatible with sea freight, air freight, and international express delivery.

 

Delivery time

Standard particle size in stock; ships within 3–7 days after order confirmation.
Paste/foil customization: 7–15 days

 

Batch Traceability

For each batch, a sample is retained, and the COA report is shipped with the goods.
Supports third-party testing (e.g., SGS)

 

Small-gramage sample

Supports the purchase of 50 g, 100 g, and 500 g samples of powders and solder pastes.
Due to the high price of silver-based brazing filler metal, free samples are not available; trial samples must be purchased.

 

Customized Services

Particle size customization, solder paste viscosity adjustment, foil size customization
Meets special operating conditions and equipment requirements

 

Technical Support

Provides brazing process parameters and usage guidelines.
Assist in resolving ceramic/metal brazing issues.

Inquire Now for Free Samples

Fill out the form on the right or contact us directly; we will provide product samples, technical data sheets, and price quotes to help you quickly complete your additive manufacturing process validation.

WhatsApp:+86 181 4263 6992

E-mail: sales01@hntijo.com

Address: No.39, Liandong Yougu lnd. Park, Bachelor Street,Changsha City,Hunan Province, China.

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