Nickel-based
Nickel-based filler material is a brazing filler composed of nickel as the matrix, supplemented with low-melting-point elements (such as boron, silicon, phosphorus, etc.) and strengthening elements (such as chromium, cobalt, molybdenum, tungsten, iron, etc.)
BCu92P copper-phosphorus brazing filler metal
Features:
Copper-phosphorus brazing alloys, the most widely used copper-based materials, are well suited for narrow-gap welding and exhibit excellent fluidity.
Application:
Packing:
Aluminum foil bag, iron drum, plastic drum, woven bag, pallet, customized packaging
Date of delivery:
Precision grinding, intelligent manufacturing technology, integrated solutions
3-15 days
key word:
BCu92P copper-phosphorus brazing filler metal · Self-brazing copper-based brazing powder/paste
Phosphorus content: 7.5–8.1% · Low melting point · High electrical conductivity -50 mesh / -100 mesh
Core Advantages of BCu92P Brazing Alloy
Self-brazing flux-free
At high temperatures, phosphorus reacts with copper oxide to form a phosphate slag; therefore, brazing of red copper typically does not require an additional flux, thereby simplifying the welding process.
Low-temperature, high efficiency · Moderate melting zone
The brazing temperature ranges from 720 to 843°C, with a liquidus of 770°C, minimizing thermal distortion in the base material’s heat-affected zone and making it well suited for the rapid brazing of copper and copper alloys.
High electrical conductivity
The weld seam exhibits electrical conductivity comparable to that of the base material, with excellent electrical performance, making it suitable for conductive connections such as power busbars and high-frequency conductors.
Corrosion-resistant · Dense welds
The brazed joint is dense, resistant to humid and mildly acidic environments, and exhibits high long-term service reliability.
Product Real-World Photos & Microscopic Morphology
Powder SEM
Irregular to near-spherical particles with uniform particle size and excellent flowability.
Real-life photo of powdered brazing filler metal
Gray powder, packaged in vacuum-sealed aluminum foil bags or plastic canisters.
Real-life photo of paste-type solder alloy
Syringe/plastic can packaging, ready-to-use, with adjustable viscosity.
BCu92P copper-phosphorus self-fluxing brazing filler metal
BCu92P (corresponding to ISO CuP 181a) is a high-phosphorus copper-based brazing filler metal with a phosphorus content of 7.5–8.1%, representing a high‑phosphorus, low‑melting‑point grade within the copper‑phosphorus brazing alloy system. Its elevated phosphorus level imparts excellent self‑fluxing properties, enabling flux‑free brazing of red copper with welds that are dense and exhibit electrical conductivity comparable to pure copper. With a liquidus temperature of 770°C, it is recommended for brazing in the range of 720–843°C and is suitable for flame, induction, and resistance brazing. The powder is produced via atomization combined with precision sieving, with primary particle sizes of −50 mesh (≤300 μm) and −100 mesh (≤150 μm), catering to applications ranging from coarse‑powder soldering to fine‑powder pastes. The brazing paste is formulated by blending the powder with an organic binder (solid content 70–90%), offering ready‑to‑use performance and precise application. Free of silver, this product delivers outstanding cost efficiency, making it a preferred bulk consumable for brazing copper and copper alloys. It finds extensive use in air‑conditioning and refrigeration piping, power busbar connections, high‑frequency conductor sealing, and the brazing of copper hardware components.
Chemical Composition (wt%, Preferred Grade)
| Grade | Cu | P | Total impurities | Solidus (°C) | Liquidus temperature (°C) | Brazing temperature (°C) |
|---|---|---|---|---|---|---|
| BCu92P | Bal. | 7.5-8.1 | ≤0.20 | 710 | 770 | 720-843 |
* Complies with ISO CuP 181a, with an oxygen content ≤ 0.10%. Phosphorus content is precisely controlled to ensure brazing fluidity and self‑brazing performance.
Particle Size Specifications & Physical Properties (Powder Form)
| Particle size specification | Corresponding mesh count | D50 range (μm) | Loose packing density (g/cm³) | Tap density (g/cm³) | Flowability (s/50g) | Recommended Process |
|---|---|---|---|---|---|---|
| -50 mesh | ≤300μm | 120-180 | ≥3.5 | ≥4.5 | ≤28 | Flame brazing, powder spreading, and preformed foil pressing |
| -100 mesh | ≤150μm | 70-110 | ≥3.6 | ≥4.6 | ≤26 | Paste raw materials, induction brazing, automatic powder feeding |
| -200 mesh | ≤75μm | 45-65 | ≥3.8 | ≥4.8 | ≤25 | Fine paste and fine powder brazing |
* -50 mesh and -100 mesh are our standard recommended specifications; other particle sizes are available upon request.
Solder Paste Specification (BCu92P)
| Grade | Alloy powder content (wt%) | Binder (wt%) | Solidus (°C) | Liquidus temperature (°C) | Recommended Process |
|---|---|---|---|---|---|
| BCu92P solder paste | 70-90 | Margin | 710 | 770 | Automatic dispensing, screen printing, manual coating |
* Viscosity can be customized to suit the customer’s dispensing equipment (10,000–500,000 cP), with complete carrier evaporation and minimal residue.
BCu92P Brazing Process Reference
| Base material combination | Recommended Brazing Temperature (°C) | Flux Usage | Joint characteristics |
|---|---|---|---|
| Red copper–red copper | 730-780 | Usually no flux is required (self-fluxing). | The brazed joint is dense and exhibits high electrical conductivity. |
| Red copper–brass | 750-810 | FB102 may be used in small quantities. | Good wetting, with a full brazing angle. |
| Brass - Brass | 770-830 | It is recommended to use FB102. | The brazed joint is bright and exhibits high strength. |
| Copper-steel | 780-840 | FB102/borax is required. | Suitable for non-pressure-bearing components, in combination with medium. |
* Red copper exhibits the best self‑brazing performance; for brass, it is recommended to use a small amount of flux. Induction brazing is best performed at higher temperatures, while flame brazing should be carried out with a neutral flame.
BCu92P vs Other Copper-Phosphorus Brazing Alloys
| Grade | Phosphorus content (%) | Liquidus temperature (°C) | Self-brazing | Resilience | Typical Applications | |
|---|---|---|---|---|---|---|
| BCu92P | 7.5-8.1 | 770 | Excellent | Relatively brittle | The first choice for brazing red copper | |
| BCuP-2 | 6.5-7.0 | 800 | Good | Medium | General-purpose copper brazing | |
| BCuP-5 | 5.8-6.2 | 870 | General | Better | Brazing of Large Workpieces |
BCu92P is the grade with the highest phosphorus content and the lowest melting point in the copper–phosphorus system; it exhibits excellent self‑brazing performance and is the material of choice for brazing red‑copper pipe fittings.
Powdered brazing filler metal (-50 mesh / -100 mesh)
- The powder can be applied directly, or pre‑formed solder tabs can be pressed on.
- It exhibits excellent fluidity, making it well-suited for automated powder feeding and flame brazing.
- It can be blended with other metal powders to formulate special compositions.
- Vacuum-packed for long-term storage without oxidation.
Paste-type brazing filler metal (ready-to-use)
- No on-site mixing of powder and adhesive is required; simply open the container and use.
- Excellent thixotropy, precise dispensing/printing, and no sagging.
- The carrier volatilizes completely, leaving minimal residue (a no‑clean formulation is available).
- Viscosity is adjustable, making it compatible with various dispensing equipment and manual coating applications.
Typical application areas
Refrigeration equipment
Air conditioner/refrigerator condenser and evaporator piping, compressor copper fittings
Power industry
Busbar connections, cable joints, transformer windings, grounding terminals
Electronic components
High-frequency conductors, vacuum device sealing, RF connectors
Hardware processing
Copper fittings, valves, radiators, plumbing and bathroom fixtures
Automotive industry
Radiator, oil cooler, air-conditioning piping, sensor housing
General Industry
Copper heat exchangers, conductive components, and pipe brazing
End-to-end testing capability
For each batch of BCu92P powder, chemical composition (Cu, P), particle size distribution, oxygen content, flowability, and tapped density are analyzed, and a Certificate of Analysis (COA) is provided.
Packaging & Delivery
Welding powder packaging
Double-layer aluminum foil bag or vacuum packaging + iron drum/plastic drum
Specifications: 1 kg, 5 kg, 10 kg, 20 kg, 50 kg
Solder paste packaging
Syringes (10 cc/30 cc/50 cc) or plastic containers (100 g/500 g/1 kg)
Refrigerate; shelf life: 6 months.
Delivery time
In-stock items will be shipped within 2–5 days after order confirmation.
Customized paste—ships in 3–7 days.
Batch Traceability
Sample retained for each batch; COA report shipped with the goods.
Reports are available.
Free sample
Provide samples
For brazing process validation
Technical Support
Provide brazing temperature profiles and optimize solder paste process parameters.
Assist customers in resolving brazing issues.
Chemical composition（wt%）
powder Grade | Chemical composition | ||
Cu | Sn | O | |
BCu92P | BAl. | 7.5-8.5 | ≤ 0.08 |
Physical indicators
Powder grade | Solid–liquid phase °C | Brazing temperature °C | Powder morphology | Loose packing density g/ centimeter ³ | Powder sieving ( eye ) | Other morphologies |
BCu92P | 710-770 | 720-843 | Spherical | ≥ 3.8 | 100/300 | powder / ointment |
Application areas
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Address: No.39, Liandong Yougu lnd. Park, Bachelor Street,Changsha City,Hunan Province, China.
