Other materials
3D Printing、MIM、HIP、Brazing、Spraying、Porous material、PM
SnAgCu0307
Features:
It has low melting point, good wettability and fatigue resistance, and the volume of the solder expands slightly when it solidifies which is beneficial to eliminating shrinkage cavities; its low melting point can meet the needs of packaging of electronic
Application:
Packing:
Precision grinding, intelligent manufacturing technology, integrated solutions
Aluminum foil bag, iron drum, plastic drum, woven bag, pallet, customized packaging
Date of delivery:
Precision grinding, intelligent manufacturing technology, integrated solutions
3-15 days
key word:
Model：SnAgCu0307
Chemical composition（wt%）
|
Code |
Chemical Composition（wt%） |
||||||||
|
|
Sn |
Ag |
Cu |
Impurities， ≤ |
|||||
|
|
|
|
|
Pb |
Sb |
Bi |
Zn |
Al |
As |
|
SnAgCu0307 |
98.5-99.5 |
0.2-0.4 |
0.5-0.9 |
0.050 |
0.050 |
0.050 |
0.001 |
0.001 |
0.030 |
|
|
|
|
|
Au |
Cd |
Fe |
Ge |
Ni |
In |
|
|
|
|
|
0.050 |
0.002 |
0.020 |
0.050 |
0.010 |
0.050 |
Physical indicators
【Density】7.3g/cm3
【solidus】227℃
【Specifications】25-45μm、15-25μm、5-20μm
Application areas
Aerospace
High temperature resistance and corrosion resistance and can be used as turbine blade material for engines
Electronics Industry
Used for welding in the manufacture of various electronic components, circuit boards, mobile phones, laptops and other electronic products.
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View DetailsMaybe you want to know something else.
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