Other materials

3D Printing、MIM、HIP、Brazing、Spraying、Porous material、PM

+
  • SnAgCu0307.jpg

SnAgCu0307


Features:

It has low melting point, good wettability and fatigue resistance, and the volume of the solder expands slightly when it solidifies which is beneficial to eliminating shrinkage cavities; its low melting point can meet the needs of packaging of electronic

Application:

Mainly used in the fields of laser, jet printing, solid crystal solder paste, microelectronics and semiconductor packaging solder, etc. It can also be used as a small wire diameter temperature fuse



Model:SnAgCu0307

 

Chemical composition(wt%)

 

Code

Chemical Compositionwt% 

 

Sn

Ag

Cu

                       Impurities 

 

 

 

 

Pb

Sb

Bi

Zn

Al

As

SnAgCu0307

98.5-99.5

0.2-0.4

0.5-0.9

0.050

0.050

0.050

0.001

0.001

0.030

 

 

 

 

Au

Cd

Fe

Ge

Ni

In

 

 

 

 

0.050

0.002

0.020

0.050

0.010

0.050

Physical indicators

Density7.3g/cm3

solidus227

Specifications25-45μm15-25μm5-20μm

Application areas

Recommend products

Product customization

Submit immediately
All
  • All
  • Product Management
  • News
  • Introduction
  • Enterprise outlets
  • FAQ
  • Enterprise Video
  • Enterprise Atlas

316L、17-4PH、304L、MS1、FeSi6.5、FeCrAl、HK30、430