Other materials

3D Printing、MIM、HIP、Brazing、Spraying、Porous material、PM

Electrolytic copper powder

Electrolysis can control the particle size of the powder so it can produce ultra -fine powder. It has high purity and larger surface area with good formability which powder shape is generally branched and suppressed

CuZn45

Excellent figurability and high strength, good weldability and machinability properties

CuSn3P7

It has high-strength and high toughness as well as good high temperature properties and corrosion resistance and good welding performance that can fill the small gap connector, we suggest the joint gap is 0.025-0.075mm

BCu92P

Similar with the eutectic composition of copper phosphorus, low welding temperature, The flowability of solder is very excellent, suitable for small junction of solder gaps, and formed very small solder angle after solder

CuMnNi

High strength, good wettability for substrate, properties of excellent welding performance, electrical conductivity, corrosion resistance and processability

Spherical Copper Powder

Gas atomization process, high density, high purity, good flowability, uniform particle distribution

CuSn20

Low melting point, good compactability, easy sintering; excellent strength、thermal conductivity、wear resistance 、color and lustre

CuSnTi

Gas atomization process, spherical powder, low oxygen content, particle size controllable 

CuSnPNi

Gas atomization process, spherical powder, low oxygen content, particle size controllable

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316L、17-4PH、304L、MS1、FeSi6.5、FeCrAl、HK30、430