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BAg18CuP Silver base brazing filler metals
【 Characteristic 】
- Ternary eutectic solder
- Low temperature and good fluidity
- Good process performance
- Brittle intermetallic compounds will be formed at the weld, which cannot be used to connect ferrous metals, nickel based alloys or nickel copper alloys containing more than 10% nickel.
【 Application 】
- Brazing of copper and copper alloys
- It is applicable to tight fitting joints, and the recommended joint gap size is 0.025-0.075mm.
Minimum order quantity:>1kg
Information
TIJO-Silver base filler metal | |||||||||||
code | Ag | Cu | Zn | Sn | Cd | Si | Ti | In | P | Ni | Brazing temperature |
BVAg-0 | ≥99.95 | 0.05 | 0.001 | - | 0.001 | - | - | - | 961-1038℃ | ||
BAg-7 | 55.0-57.0 | 21.0-23.0 | 15.0-19.0 | 4.5-5.5 | - | - | - | - | 652-760℃ | ||
BAg-8 | 71.0-73.0 | 27.0-29.0 | - | - | ≤0.01 | ≤0.05 | - | - | 779-899℃ | ||
BAg-36 | 44.0-46.0 | 26.0-28.0 | 23.5-27.5 | 2.0-3.0 | - | - | - | - | 677-813℃ | ||
Ag30CuZnSn | 29-31 | 35-37 | 30-34 | 1.5-2.5 | 0.01 | 0.05 | 670-755℃ | ||||
Ag18CuP | 17.0-19.0 | Bal. | 6.6-7.5 | 643-686℃ | |||||||
AgCuNi | 76-78 | Bal. | 2.0-4.0 | 860-950℃ | |||||||
AgCuTi | 68.7-70.7 | Bal | - | - | - | - | 2.0-5.0 | - | 830-930℃ | ||
AgCuInTi | 42.6-44.6 | 28.1-30.1 | - | - | - | - | 2.0-5.0 | 23.3-25.3 | 650-800℃ | ||
*以上数据来源于天久金属 | |||||||||||
BAg18CuP Silver base brazing filler metals
As a leading enterprise specializing in the production and supply of Ag18CuP silver-based solder powder, we are committed to providing customers with excellent products and solutions. Ag18CuP silver-based solder powder has become the first choice for high-efficiency connections because of its unique characteristics. The following are the highlights of Ag18CuP silver-based solder, let us explore together:
Excellent welding performance: Ag18CuP silver-based solder powder has excellent welding performance. It can realize reliable welding connection with various substrates such as copper, stainless steel, nickel alloy, etc. Whether it is a small solder joint or a complex solder joint, Ag18CuP silver-based solder powder can meet your needs and ensure the strength and reliability of the solder joint.
Excellent conductivity: Ag18CuP silver-based solder powder has excellent conductivity. It conducts electrical current quickly, enabling efficient electronic connections. Whether in electronic equipment manufacturing, communication equipment or power industry, Ag18CuP silver-based solder powder can meet your high-performance requirements and provide stable and reliable electronic connections.
High temperature stability: Ag18CuP silver-based solder powder has good high temperature stability. Maintain stability and durability in high temperature environments, resist high temperature oxidation and corrosion. Whether in the automotive, aerospace or energy industries, Ag18CuP silver-based solder powders ensure long-term reliable operation of solder joints.
Wide range of applications: Ag18CuP silver-based solder powder is widely used in electronics, automobile manufacturing, aerospace and other fields. Whether soldering electronic components, automotive engine parts, or aerospace equipment, Ag18CuP silver-based solder powder provides a reliable connection solution for a variety of high-end applications.
We promise to provide high-quality Ag18CuP silver-based brazing powder products to ensure its stability and consistency, and provide reliable technical support for your projects. Choose us, you will get high-quality products and professional services to achieve the goal of efficient connection!
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