CuSnPNi Copper based brazing filler metals
【Characteristic】
-Good liquidity
-Low temperature copper phosphorus solder
-It is suitable for tight fitting joints. The brazing seam is full and beautiful. The brazing pure copper has the function of self brazing flux
-There is no need to add flux, which is more economical than silver solder
-The corrosion resistance of the joint is equivalent to that of copper
【Applications】
- It is suitable for brazing copper with silver and its alloys, such as electric contact products and copper joints. Steel, nickel based alloys and copper alloys with more than 10% Ni cannot be brazed
- Suitable for furnace, induction, flame, resistance brazing and other processes
Information
【Chemical Composition】
Code | Chemical Composition(wt%) | ||||||
Cu | Sn | P | Ni | 熔化温度范围Melting range(℃) | 钎焊温度(℃) Brazing Temperature | ||
固相线Solidus | 液相线Liquidus | ||||||
BCu86SnPNi | Bal. | 7.0-8.0 | 4.8-5.8 | 0.4-1.2 | 620 | 670 | 682-812 |
CuSn15.6PNi4.2 | Bal. | 15.1-16.1 | 4.7-5.7 | 3.8-4.8 | 585 | 605 | 605-800 |
Code | Composition(wt%) | |||
Alloy powder | binder | (℃) | ||
Melting point | Melting point | |||
BCu86SnPNi | 80-90 | Bal. | 620 | 670 |
CuSn15.6PNi4.2 | 80-90 | Bal. | 585 | 605 |