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Spherical copper based powder

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CuSnPNi
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CuSnPNi Copper based brazing filler metals


【 Characteristic 】

-Good liquidity

-Low temperature copper phosphorus solder

-It is suitable for tight fitting joints. The brazing seam is full and beautiful. The brazing pure copper has the function of self brazing flux

-There is no need to add flux, which is more economical than silver solder

-The corrosion resistance of the joint is equivalent to that of copper


【 Applications 】

- It is suitable for brazing copper with silver and its alloys, such as electric contact products and copper joints. Steel, nickel based alloys and copper alloys with more than 10% Ni cannot be brazed

- Suitable for furnace, induction, flame, resistance brazing and other processes


Minimum order quantity:>1kg

Inquiry
Information

Copper base filler metal

Code

Cu

P

Sn

Ni

Ti

Mn

Zn

钎焊温度

BCu-1

99.9

-

-

-

-

-

-

1093-1149℃

BCu92P

Bal

7.5-8.1

-

-

-

-

-

720-843℃

CuSn3P7

Bal

6.0-8.0

2.0-4.0

-

-

-

-

690-900℃

qCuP-11

Bal

4.7-5.7

15.1-16.1

3.8-4.8

-

-

-

605-800

CuSnTi

Bal

-

18.0-20.0

-

9.0-11.0

-

-

880-930℃

BCu84MnNi

Bal

-

-

1.5-5.0

-

11.0-14.0

-

1000-1050℃

BCu86SnPNi

Bal

4.8-5.8

7.0-8.0

0.4-1.2

682-812℃

CuSn15.6PNi4.2

Bal.

4.7-5.7

15.1-16.1

3.8-4.8

605-800℃

CuSn10

Bal

-

9.5-10.5

-

-

-

-

1020-1090℃

CuZn48

50.0-53.0

-

-

-

-

-

Bal

910-1000

Cu55ZnNiMn

53.0-57.0

-

-

5.0-7.0

-

3.0-5.0

Bal

940-1040

*以上数据来源于天久金属


CuSnPNi Copper based brazing filler metals

As a professional CuSnPNi copper-based brazing powder supplier, we are committed to providing customers with excellent brazing solutions. CuSnPNi copper-based solder powder is widely acclaimed in the field of brazing for its unique composition and excellent performance. The following are the highlights of CuSnPNi copper-based solder powder, let us explore together:

Excellent soldering performance: CuSnPNi copper-based solder powder has excellent soldering performance for efficient connections. It has a moderate melting point and good wettability, can effectively fill the weld, form a stable and reliable connection, and improve welding quality and strength.

High temperature stability: CuSnPNi copper-based solder powder has excellent high temperature stability and can still maintain good performance in high temperature environments. Suitable for brazing applications under various high temperature conditions, such as automotive engines, aerospace equipment, etc.

Good conductivity: CuSnPNi copper-based solder powder has good conductivity and can provide high-quality current conduction. It is ideal for the manufacture of electronic components, conductive connectors, and more, improving the performance and reliability of equipment.

Multi-field application: CuSnPNi copper-based solder powder is widely used in automotive, electronics, aerospace and other fields. It can be used for welding different materials such as metal and ceramics, metal and plastic, and meets the requirements of different industries for connection performance.

Choose us, you will get high-quality CuSnPNi copper-based brazing powder products and professional services to help you succeed in the field of brazing! Let us work together to create brilliant!


Applications

详情页CuSnPNi(qCuP-11)_02

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