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Spherical copper based powder

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CuSnPNi
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CuSnPNi Copper based brazing filler metals


Characteristic

-Good liquidity

-Low temperature copper phosphorus solder

-It is suitable for tight fitting joints. The brazing seam is full and beautiful. The brazing pure copper has the function of self brazing flux

-There is no need to add flux, which is more economical than silver solder

-The corrosion resistance of the joint is equivalent to that of copper

Applications

- It is suitable for brazing copper with silver and its alloys, such as electric contact products and copper joints. Steel, nickel based alloys and copper alloys with more than 10% Ni cannot be brazed

- Suitable for furnace, induction, flame, resistance brazing and other processes


Inquiry
Information

Chemical Composition



Code

Chemical Compositionwt%

Cu

Sn

P

Ni

熔化温度范围Melting range

钎焊温度(

Brazing Temperature

固相线Solidus

液相线Liquidus

BCu86SnPNi

Bal.

7.0-8.0

4.8-5.8

0.4-1.2

620

670

682-812

CuSn15.6PNi4.2

Bal.

15.1-16.1

4.7-5.7

3.8-4.8

585

605

605-800

 


Code

Compositionwt%


Alloy powder


binder

Melting point

Melting point

BCu86SnPNi

80-90

Bal.

620

670

CuSn15.6PNi4.2

80-90

Bal.

585

605


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