CuZn30 Copper based brazing filler metals
【 Characteristic 】
-Good plasticity and high strength
-Good machinability
-Easy to weld
【 Applications 】
-Machine tool guide rail soft belt
-Tetrafluoro sealing material
-Sintered diamond tool matrix
-Resin based brake pads
Minimum order quantity:>1kg
Information
Copper base filler metal | ||||||||
Code | Cu | P | Sn | Ni | Ti | Mn | Zn | 钎焊温度 |
BCu-1 | ≥99.9 | - | - | - | - | - | - | 1093-1149℃ |
BCu92P | Bal | 7.5-8.1 | - | - | - | - | - | 720-843℃ |
CuSn3P7 | Bal | 6.0-8.0 | 2.0-4.0 | - | - | - | - | 690-900℃ |
qCuP-11 | Bal | 4.7-5.7 | 15.1-16.1 | 3.8-4.8 | - | - | - | 605-800℃ |
CuSnTi | Bal | - | 18.0-20.0 | - | 9.0-11.0 | - | - | 880-930℃ |
BCu84MnNi | Bal | - | - | 1.5-5.0 | - | 11.0-14.0 | - | 1000-1050℃ |
BCu86SnPNi | Bal | 4.8-5.8 | 7.0-8.0 | 0.4-1.2 | 682-812℃ | |||
CuSn15.6PNi4.2 | Bal. | 4.7-5.7 | 15.1-16.1 | 3.8-4.8 | 605-800℃ | |||
CuSn10 | Bal | - | 9.5-10.5 | - | - | - | - | 1020-1090℃ |
50.0-53.0 | - | - | - | - | - | Bal | 910-1000℃ | |
Cu55ZnNiMn | 53.0-57.0 | - | - | 5.0-7.0 | - | 3.0-5.0 | Bal | 940-1040℃ |
*以上数据来源于天久金属 |
CuZn30 Copper based brazing filler metals
We are a professional supplier of CuZn30 copper-based brazing powder, committed to providing customers with high-quality brazing solutions. CuZn30 copper-based solder powder is recognized for its strong solderability and high reliability. The following are the unique advantages of CuZn30 copper-based solder powder, let us discuss together:
Stable and reliable connection: CuZn30 copper-based solder powder can form a stable and reliable connection, ensuring the strength and tightness of the welded joint. With excellent wetting and filling performance, it can perfectly fill the weld seam and improve welding quality and reliability.
High strength and heat resistance: CuZn30 copper-based solder powder has excellent material strength and heat resistance. In a high temperature environment, it can maintain stable welding performance without loosening or breaking, ensuring the durability and reliability of the connection.
Excellent electrical and thermal conductivity: CuZn30 copper-based solder powder has excellent electrical and thermal conductivity, making it excellent in soldering applications for electronic devices and heat-conducting devices. It effectively conducts current and heat, improving device performance and stability.
Wide range of applications: CuZn30 copper-based solder is widely used in electronics, automobiles, aerospace and other fields. Whether it is metal-to-metal connection or metal-to-ceramic connection, it can meet the connection performance requirements of different industries and provide reliable solutions for various application scenarios.
Choose us, you will get high-quality CuZn30 copper-based brazing powder products and professional services to help you succeed in the field of brazing! Let us work together to create brilliant!