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Spherical copper based powder

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BCU92P Copper alloy powder


Characteristic

-Close to copper phosphorus eutectic composition

-Low brazing temperature

-Excellent fluidity of solder

-It is suitable for joints with small brazing gap, and the brazing angle formed after brazing is extremely small

Applications

-Commonly used in Electromechanical, instrument, refrigeration and other industries, brazing copper and brass parts without impact load.

Minimum order quantity:>1kg

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Information

Chemical Composition

Code
Chemical Composition(wt%)
CuSnPNi
Melting range(℃)

Brazing

 Temperature(℃)

SolidusLiquidus
qCuP-6Bal.7.0-8.04.8-5.80.4-1.2620670682-812
qCuP-11Bal.15.1-16.14.7-5.73.8-4.8585605605-800
CodeComposition(wt%)
alloy powder
BinderMelting range(℃)
SolidusLiquidus
qCuP-680-90Bal.620670
qCuP-1180-90Bal.585605


Other Grades

No.CodeCuPSnNiTiMnZn
1BCu-1a≥99.9----
--
2BCu92PBal7.5-8.1-----
3CuSn3P7Bal6.0-8.02.0-4.0----
4qCuP-11Bal4.7-5.715.1-16.13.8-4.8---
5CuSnTiBal-18.0-20.0-9.0-11.0--
6BCu84MnNiBal--1.5-5.0-11.0-14.0-
7CuSn10Bal-9.5-10.5----
8CuZn4850.0-53.0--
---Bal
9Cu55ZnNiMn53.0-57.0--5.0-7.0--Bal


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