BCU92P Copper alloy powder
【Characteristic】
-Close to copper phosphorus eutectic composition
-Low brazing temperature
-Excellent fluidity of solder
-It is suitable for joints with small brazing gap, and the brazing angle formed after brazing is extremely small
【Applications】
-Commonly used in Electromechanical, instrument, refrigeration and other industries, brazing copper and brass parts without impact load.
Minimum order quantity:>1kg
Information
Chemical Composition
Code | Chemical Composition(wt%) | ||||||
Cu | Sn | P | Ni | Melting range(℃) | Brazing Temperature(℃) | ||
Solidus | Liquidus | ||||||
qCuP-6 | Bal. | 7.0-8.0 | 4.8-5.8 | 0.4-1.2 | 620 | 670 | 682-812 |
qCuP-11 | Bal. | 15.1-16.1 | 4.7-5.7 | 3.8-4.8 | 585 | 605 | 605-800 |
Code | Composition(wt%) | |||
alloy powder | Binder | Melting range(℃) | ||
Solidus | Liquidus | |||
qCuP-6 | 80-90 | Bal. | 620 | 670 |
qCuP-11 | 80-90 | Bal. | 585 | 605 |
Other Grades
No. | Code | Cu | P | Sn | Ni | Ti | Mn | Zn |
1 | BCu-1a | ≥99.9 | - | - | - | - | - | - |
2 | BCu92P | Bal | 7.5-8.1 | - | - | - | - | - |
3 | CuSn3P7 | Bal | 6.0-8.0 | 2.0-4.0 | - | - | - | - |
4 | qCuP-11 | Bal | 4.7-5.7 | 15.1-16.1 | 3.8-4.8 | - | - | - |
5 | CuSnTi | Bal | - | 18.0-20.0 | - | 9.0-11.0 | - | - |
6 | BCu84MnNi | Bal | - | - | 1.5-5.0 | - | 11.0-14.0 | - |
7 | CuSn10 | Bal | - | 9.5-10.5 | - | - | - | - |
8 | CuZn48 | 50.0-53.0 | - | - | - | - | - | Bal |
9 | Cu55ZnNiMn | 53.0-57.0 | - | - | 5.0-7.0 | - | - | Bal |
Customer Questions & Answers
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