BCu92P Copper alloy powder
【 Characteristic 】
-Close to copper phosphorus eutectic composition
-Low brazing temperature
-Excellent fluidity of solder
-It is suitable for joints with small brazing gap, and the brazing angle formed after brazing is extremely small
【 Applications 】
-Commonly used in Electromechanical, instrument, refrigeration and other industries, brazing copper and brass parts without impact load.
Minimum order quantity:>1kg
Information
Copper base filler metal | ||||||||
Code | Cu | P | Sn | Ni | Ti | Mn | Zn | 钎焊温度 |
BCu-1 | ≥99.9 | - | - | - | - | - | - | 1093-1149℃ |
BCu92P | Bal | 7.5-8.1 | - | - | - | - | - | 720-843℃ |
CuSn3P7 | Bal | 6.0-8.0 | 2.0-4.0 | - | - | - | - | 690-900℃ |
qCuP-11 | Bal | 4.7-5.7 | 15.1-16.1 | 3.8-4.8 | - | - | - | 605-800℃ |
CuSnTi | Bal | - | 18.0-20.0 | - | 9.0-11.0 | - | - | 880-930℃ |
BCu84MnNi | Bal | - | - | 1.5-5.0 | - | 11.0-14.0 | - | 1000-1050℃ |
BCu86SnPNi | Bal | 4.8-5.8 | 7.0-8.0 | 0.4-1.2 | 682-812℃ | |||
CuSn15.6PNi4.2 | Bal. | 4.7-5.7 | 15.1-16.1 | 3.8-4.8 | 605-800℃ | |||
CuSn10 | Bal | - | 9.5-10.5 | - | - | - | - | 1020-1090℃ |
50.0-53.0 | - | - | - | - | - | Bal | 910-1000℃ | |
Cu55ZnNiMn | 53.0-57.0 | - | - | 5.0-7.0 | - | 3.0-5.0 | Bal | 940-1040℃ |
*以上数据来源于天久金属 |
BCu92P Copper alloy powder
We are a professional supplier of BCu92P copper-based brazing powder, providing you with high-quality and innovative brazing solutions. BCu92P copper-based solder powder is praised for its strong connection and excellent performance. The following are the unique advantages of BCu92P copper-based solder powder, let us discuss together:
Strong connection performance: BCu92P copper-based solder powder can form a firm connection to ensure the reliability and durability of solder joints. It has good wetting and filling properties to perfectly fill solder joints and achieve a strong connection. No matter in high temperature environment or harsh working conditions, BCu92P copper-based solder can maintain stable connection performance.
Multifunctional application: BCu92P copper-based solder powder has a wide range of applications in all walks of life. It is suitable for the connection of metal to metal, as well as the connection of metal to ceramic, metal to glass and other materials. Whether it is electronic devices, automobile manufacturing or aerospace, BCu92P copper-based solder powder can provide you with efficient and reliable connection solutions.
Advanced material properties: BCu92P copper-based solder powder has excellent material properties. It has excellent corrosion resistance and oxidation resistance, and can still maintain stable performance in harsh environments. At the same time, it also has excellent electrical and thermal conductivity, which can efficiently conduct current and heat, and improve the performance and reliability of the device.
Choose us, you will get high-quality BCu92P copper-based brazing powder products and professional services to help you succeed in the field of brazing! Let us work together to create brilliant!