CuZnMnNi Copper alloy powder
【 Characteristic 】
- Adding manganese, nickel, cobalt and other elements to copper zinc brazing filler metal can improve the wettability and significantly improve the brazing joint strength. When adding Mn, when brazing YG8, YT5, YT15 and other cemented carbides, the joint tensile strength can reach 300-320mpa at room temperature and 220-240mpa at 320℃. The addition of nickel can further increase the wettability of brazing filler metal to cemented carbides, making its brazing structure and performance better, Improve the impact toughness and fatigue impact strength of cemented carbide tools
【 Applications 】
- Cemented carbide brazing
Minimum order quantity:>1kg
Information
Copper base filler metal | ||||||||
Code | Cu | P | Sn | Ni | Ti | Mn | Zn | 钎焊温度 |
BCu-1 | ≥99.9 | - | - | - | - | - | - | 1093-1149℃ |
BCu92P | Bal | 7.5-8.1 | - | - | - | - | - | 720-843℃ |
CuSn3P7 | Bal | 6.0-8.0 | 2.0-4.0 | - | - | - | - | 690-900℃ |
qCuP-11 | Bal | 4.7-5.7 | 15.1-16.1 | 3.8-4.8 | - | - | - | 605-800℃ |
CuSnTi | Bal | - | 18.0-20.0 | - | 9.0-11.0 | - | - | 880-930℃ |
BCu84MnNi | Bal | - | - | 1.5-5.0 | - | 11.0-14.0 | - | 1000-1050℃ |
BCu86SnPNi | Bal | 4.8-5.8 | 7.0-8.0 | 0.4-1.2 | 682-812℃ | |||
CuSn15.6PNi4.2 | Bal. | 4.7-5.7 | 15.1-16.1 | 3.8-4.8 | 605-800℃ | |||
CuSn10 | Bal | - | 9.5-10.5 | - | - | - | - | 1020-1090℃ |
50.0-53.0 | - | - | - | - | - | Bal | 910-1000℃ | |
Cu55ZnNiMn | 53.0-57.0 | - | - | 5.0-7.0 | - | 3.0-5.0 | Bal | 940-1040℃ |
*以上数据来源于天久金属 |
CuZnMnNi Copper alloy powder
We are a professional CuZnMnNi copper-based brazing powder supplier, committed to providing customers with high-quality brazing solutions. CuZnMnNi copper-based solder powders are recognized for their strong connections and versatile applications. The following are the unique advantages of CuZnMnNi copper-based solder powder, let us discuss together:
Stable and reliable connection: CuZnMnNi copper-based solder powder can form a stable and reliable connection, ensuring the strength and tightness of the solder joint. With excellent wetting and filling performance, it can perfectly fill the weld seam and improve welding quality and reliability.
Multifunctional use: CuZnMnNi copper-based solder powder is widely used. It is suitable for metal-to-metal connections and metal-to-ceramic connections. Whether it is electronic devices, auto parts or aerospace equipment, CuZnMnNi copper-based solder powder can meet the requirements of different industries for connection performance.
Excellent material properties: CuZnMnNi copper-based solder powder has excellent material properties. With high strength and corrosion resistance, it can maintain stable performance in various harsh environments. At the same time, it also has good electrical and thermal conductivity, which can efficiently conduct current and heat, and improve the performance and stability of the device.
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